Resilient Heat Transfer Element for Modular CCA Thermal Management

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Solution Overview

Problem

The increasing modularity in circuit card assemblies (CCAs) reduces opportunities for permanent thermal interface features, posing challenges for effective thermal management as power dissipation grows with advanced designs.

Innovation Solution

A heat transfer element, which is metallic and resiliently compressed between the CCA module and a removable chassis cover, provides enhanced heat sinking capabilities through undulations that compress to ensure intimate thermal contact, allowing for flexible installation and removal with the module or cover, and optionally includes heat transfer fins for additional cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If modular CCA designs are used to enable quick installation and removal, then ease of operation is improved, but thermal management capability deteriorates due to reduced opportunities for permanent thermal interface features

Engineering Contradiction:

Improveinstallation and removal speedVSAvoidthermal management capability

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The heat transfer element transitions from a static permanent fixture to a dynamic component that can be installed and removed with the modular CCA. The resilient nature allows it to adapt to varying gap conditions during installation, maintaining thermal contact pressure without requiring permanent chassis modifications.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent changes the physical state of the heat transfer element from rigid to resilient, allowing it to compress and expand based on installation conditions. This parameter change enables the element to maintain effective thermal contact despite variations in gap size, while still accommodating modular installation requirements.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If resilient heat transfer elements with undulations are used to ensure intimate thermal contact, then heat transfer efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat transfer element is segmented into multiple undulations or waves along its length. This segmentation allows each section to independently compress and conform to surface irregularities, improving thermal contact area without requiring a completely complex structured design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a flexible resilient element with thin profile that can bend and conform to mating surfaces. This flexible shell approach achieves intimate thermal contact through elasticity rather than complex mechanical structures, maintaining simplicity while improving heat transfer.

Inventive Principle:

Principle #30Flexible shells and thin films

3Adaptability or versatility

If a removable cover is used instead of permanent thermal interfaces, then adaptability is improved, but thermal contact pressure decreases

Engineering Contradiction:

Improvemodular compatibilityVSAvoidthermal contact pressure

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The resilient heat transfer element is pre-compressed during installation between the CCA and chassis cover. This preliminary compression action establishes the thermal contact pressure before the module enters service, ensuring adequate pressure is maintained throughout operation without requiring permanent installation features.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat transfer from heat-generating components, evenly distributes thermal loads, reduces complexity and weight, and allows for modular thermal management with reduced costs by using a single heat transfer element across multiple modules.

Implementation Method 1

a heat transfer element between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The heat transfer element can be resiliently compressed between the CCA module and the cover. The heat transfer element can include undulations in a direction away from the connector. The undulations in an uncompressed state can be larger than a gap between the CCA module and the cover so as to compress between the CCA module and the cover.

Methodology Applied

Scientific EffectElastic compression: Elasticity

Data Source

PatentUS11825633B2Circuit card assembly (CCA) module thermal interface devices

Publication Date: 2023.11.21 HAMILTON SUNDSTRAND CORP

AI summary

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.