Resilient Member for Memory Module Tester

Solution Overview

Problem

Existing memory module testers face issues with L-shaped pins detaching from printed circuit boards over time, leading to poor contact and decreased yield due to mechanical stress and torsion during testing.

Innovation Solution

A resilient member with a horizontal, vertical, and curved buffer segment, made of conductive copper or copper alloys, is used to electrically connect the circuit boards, forming a gap to absorb mechanical stress and torsion, preventing pin detachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If L-shaped pins are used to electrically connect the printed circuit boards, then the device complexity is reduced, but the reliability deteriorates due to pin detachment at welding points over time

Engineering Contradiction:

Improveconnection structureVSAvoidelectrical connection stability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The resilient member is divided into multiple segments: a first segment welded to the first printed circuit board, a second segment welded to the second printed circuit board, and a buffer segment connecting these segments. This segmentation allows each part to perform its specific function while collectively providing reliable electrical connection and mechanical stress absorption.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resilient member changes its physical parameters (shape, length, flexibility) to adapt to mechanical stress and torsion during memory module testing. The buffer segment specifically is designed to deform elastically, changing its dimensions to absorb stress while maintaining electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If rigid connections are used between circuit boards, then the manufacturing precision is improved, but the reliability worsens due to inability to withstand mechanical stress and torsion

Engineering Contradiction:

Improveconnection accuracyVSAvoidstress resistance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The resilient member transitions from a static rigid connection to a dynamic flexible connection that can adapt to mechanical stress and torsion during testing. The buffer segment is specifically designed to deform elastically, allowing the connection to dynamically respond to applied forces while maintaining electrical connectivity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The buffer segment of the resilient member is designed in advance to absorb and cushion mechanical stress and torsion that will occur during memory module testing. This pre-engineered cushioning capability prevents stress transmission to the welding points, thereby preventing detachment.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If simple L-shaped pins are used for electrical connection, then the ease of manufacture is improved, but the productivity deteriorates due to decreased testing yield from pin detachment

Engineering Contradiction:

Improveconnection component simplicityVSAvoidtesting yield

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The resilient member is divided into multiple segments: a first segment welded to the first printed circuit board, a second segment welded to the second printed circuit board, and a buffer segment connecting these segments. This segmentation allows each part to perform its specific function while collectively providing reliable electrical connection and mechanical stress absorption.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resilient member changes its physical parameters (shape, length, flexibility) to adapt to mechanical stress and torsion during memory module testing. The buffer segment specifically is designed to deform elastically, changing its dimensions to absorb stress while maintaining electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures stable electrical connections by resisting mechanical stress and torsion, thereby improving the yield and reliability of memory module testing.

Implementation Method 1

a curved buffer segment connecting the horizontal segment and the vertical segment... forming a gap to absorb mechanical stress and torsion

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS8773155B2MUT for testing memory modules

Publication Date: 2014.07.08 NAN YA TECH

AI summary

An MUT unit for testing memory modules includes a first circuit board; a second circuit board coupled to the first circuit board in a vertical orientation; a socket on a top surface of the first circuit board; and a resilient member electrically connecting the first and second circuit boards at an joint there between, wherein the resilient member comprises a horizontal segment that is welded to a bottom surface of the first circuit board, a vertical segment that is welded to a surface of the second circuit board, and a curved buffer segment connecting the horizontal segment and the vertical segment.