Resilient Mounting Assembly for Power Semiconductors
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Solution Overview
Problem
Existing mounting assemblies for electric compressors in climate control systems face challenges in securely and uniformly pressing power semiconductors against the cooling region, regardless of their thickness, while also being easily mountable as a simple modular inverter.
Innovation Solution
A mounting assembly with a support frame structure that includes hollow receiving volumes for power semiconductors and busbars, featuring resilient regions for flexible adaptation to semiconductor thickness and securement elements like bolts, along with an optional intermediate thermally conductive layer for improved thermal conductivity and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metal substrate with insulation foil is used to mount power semiconductors, then electrical insulation is achieved, but thermal conductivity and contact pressure consistency deteriorate
Solution Approach 1:
The invention removes the conventional insulation foil layer from between the power semiconductor and cooling region, allowing direct thermal contact while maintaining electrical insulation through the isolated mounting structure design. The mounting structure is electrically isolated from the cooling region, enabling the power semiconductor to contact both the cooling region for heat dissipation and remain electrically insulated through the mounting structure's isolation mechanism.
Solution Approach 2:
The mounting structure serves as an intermediary element that provides both mechanical support and electrical insulation while allowing thermal contact. It mediates between the power semiconductor requiring both cooling and insulation, and the cooling region providing thermal management, achieving both thermal conductivity and electrical insulation simultaneously.
2Stability of the object's composition
If rigid support frame structure is used to mount power semiconductors, then structural stability is achieved, but adaptation to varying semiconductor thicknesses deteriorates
Solution Approach 1:
The support frame structure incorporates resilient regions that provide dynamic adaptation capability. These resilient regions can deform elastically to accommodate different power semiconductor thicknesses while maintaining stable mounting, transforming the rigid structure into a dynamically adaptable one that responds to varying component dimensions.
Solution Approach 2:
The resilient regions of the support frame structure change their physical state through elastic deformation, allowing the structure to adapt its shape and contact pressure according to the thickness of mounted power semiconductors. This parameter change enables the same structure to accommodate multiple component thickness variations.
3Temperature
If high contact pressure is applied to ensure thermal contact, then thermal conductivity improves, but risk of damaging power semiconductors increases
Solution Approach 1:
The resilient regions of the support frame structure serve as a cushioning element that absorbs excess mounting pressure before it reaches the power semiconductor. This beforehand cushioning prevents damage to the semiconductor while ensuring adequate contact pressure for thermal management, protecting the component during the mounting process.
Solution Approach 2:
The resilient regions function as flexible elements that can deform under pressure, providing a compliant interface between the rigid mounting structure and the power semiconductor. This flexibility allows the structure to apply gentle, distributed pressure that ensures thermal contact without concentrating excessive force on the semiconductor.
4Ease of operation
If modular inverter design is implemented for easy mounting, then ease of installation improves, but structural complexity increases
Solution Approach 1:
The mounting structure integrates multiple functions into a single component: it provides mechanical support for power semiconductors, electrical insulation from the cooling region, resilient adaptation to thickness variations, and structural stability for mounting. This merging of functions simplifies the overall modular inverter design while maintaining ease of installation.
Solution Approach 2:
The support frame structure is designed as a universal mounting solution that can accommodate different power semiconductor types and thicknesses while providing consistent thermal and electrical management. This multi-functionality allows the same modular structure to be used across various configurations, simplifying the inverter design process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent contact pressure and thermal conductivity across power semiconductors, facilitating easy mounting and adaptation to varying semiconductor thicknesses, enhancing the thermal management and electrical insulation of the inverter components.
Implementation Method 1
the support frame structure comprises above the hollow receiving volumes a resilient region which, in the direction of the thickness of the power semiconductors or of the power module, is flexible compared to the other regions of the support frame structure
Implementation Method 2
an intermediate layer of electrically insulating, thermally conductive material is placed underneath the mounting assembly
Data Source
AI summary
A mounting assembly with wire-leaded electronic power components for an inverter of an electric compressor of a climate control system includes a support frame structure with a bottom forming an upper side and an underside, and a multiplicity of passages from the upper side to the underside for securement elements for securing the support frame structure on a motor housing. On the underside of the bottom a hollow receiving volume is implemented. A leaded power module or power semiconductor is embedded. In each hollow receiving volume is a contact region for localized contact in places of the hollow receiving volume with an upwardly facing surface of power semiconductor or power module. The opposite, downwardly facing surface of the semiconductor or the power module forms a portion of the lower outer surface area of the mounting assembly. An assembly of the mounting assembly with a compressor motor housing is also provided.