Resilient PCB Temperature Sensing in Sealed Measuring Housings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing measuring devices require additional openings or complex modifications to determine medium temperature, complicating the monitoring of process variables and increasing the risk of leakage points.
Innovation Solution
A measuring device with a resilient printed circuit board component that elastically deforms to maintain mechanical and thermal contact with the housing, allowing for temperature sensing without additional openings, using NTC thermistors and a flexible spring body to compensate for manufacturing tolerances and reduce mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is integrated into the measuring device housing, then temperature measurement capability is improved, but the housing structure becomes more complex and requires additional openings
Solution Approach 1:
The temperature sensor is integrated onto the printed circuit board that is already part of the measuring device, merging the temperature measurement function with the existing electronic structure. This eliminates the need for separate housing modifications while adding temperature measurement capability.
Solution Approach 2:
The printed circuit board serves multiple functions: it provides electrical connections for the main measuring device and simultaneously acts as a mounting platform for the temperature sensor, enabling temperature measurement without requiring dedicated structural elements.
2Measurement precision
If additional openings are made in the housing for sensor integration, then temperature sensing is improved, but the risk of leakage points and manufacturing complexity increases
Solution Approach 1:
The temperature sensor is mounted on the printed circuit board which is already sealed within the housing, combining the temperature sensing function with the existing sealed structure. This approach adds temperature measurement capability without creating additional openings or leakage points in the housing.
3Manufacturing precision
If a rigid structure is used for mounting the temperature sensor, then manufacturing precision is improved, but mechanical stress on components increases
Solution Approach 1:
The printed circuit board utilizes its inherent flexibility as a parameter change from rigid mounting structures. This flexibility allows the board to accommodate manufacturing tolerances and thermal expansion without generating excessive mechanical stress on the temperature sensor or other components.
Solution Approach 2:
The printed circuit board acts as a flexible mounting substrate for the temperature sensor, replacing rigid mounting structures. This flexibility compensates for manufacturing tolerances and reduces mechanical stress while maintaining adequate sensor positioning precision.
4Adaptability or versatility
If the printed circuit board is made resilient, then compensation for manufacturing tolerances is improved, but the structural stability decreases
Solution Approach 1:
The printed circuit board's flexibility is optimized to provide adequate tolerance compensation while maintaining sufficient structural stability. The board's mechanical properties are selected to balance adaptability for accommodating manufacturing variations with the stability needed to securely mount components and maintain electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement within the measuring device without additional openings, reducing manufacturing complexity and potential leakage points, while minimizing mechanical stress on components and improving heat transfer efficiency.
Implementation Method 1
the printed circuit board has a resilient printed circuit board component, wherein the first temperature sensor is arranged on the printed circuit board component, wherein the printed circuit board component at least partially touches the inner surface of the housing body
Implementation Method 2
using NTC thermistors and a flexible spring body to compensate for manufacturing tolerances and reduce mechanical stress
Implementation Method 3
the housing body has an inner surface; a temperature measuring apparatus, wherein the temperature measuring apparatus comprises a first temperature sensor, wherein the first temperature sensor is configured to determine a first temperature value
Data Source
AI summary
A measuring device for determining a process variable of a medium includes a housing comprising a housing body with an inner surface. The measuring device includes a temperature measuring apparatus comprising a first temperature sensor configured to determine a first temperature value, and an evaluation circuit configured to determine a medium temperature as a function of the first temperature value. The measuring device also includes a rigid printed circuit board having a resilient printed circuit board component. The first temperature sensor is arranged on the printed circuit board component. The printed circuit board component at least partially touches the inner surface of the housing body.