Resilient Pressure Element for Power Semiconductor Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power electronic circuit devices lack a controlled and flexible method to apply pressure onto substrates with power semiconductor components, which can lead to inefficient contact and potential damage.
Innovation Solution
A power electronic circuit device featuring a two-dimensional resilient pressure element with distinct pressure surface sections, where the first section is planar and the second section is curved, allowing for flexible and defined pressure distribution onto both the power semiconductor components and the connection device, utilizing a combination of elastomer and plastic foam materials with specific Shore-A hardness and compression forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a rigid pressure device is used to press onto the substrate, then the pressure application force is sufficient, but the pressure distribution is uneven and may cause damage to the power semiconductor components
Solution Approach 1:
The patent employs a resilient pressure element made of elastomeric material that acts as a flexible interface between the rigid pressure device and the substrate. This flexible element distributes the applied force uniformly across the contact surfaces, preventing localized stress concentrations that could damage the power semiconductor components while maintaining sufficient overall pressure for reliable electrical contact.
Solution Approach 2:
The patent utilizes the elastic properties of the resilient pressure element to change the pressure distribution parameters. The material's elasticity allows it to deform and conform to the substrate surface, automatically adjusting the pressure distribution to achieve uniform contact without exceeding the damage threshold of the semiconductor components.
2Reliability
If pressure is applied directly onto the contact pad, then the electrical connection is secure, but the connection device cannot accommodate thermal expansion and movement
Solution Approach 1:
The resilient pressure element serves as a flexible intermediary that maintains reliable electrical contact while accommodating dimensional changes. Its elastic nature allows it to compress and expand, absorbing thermal expansion and movement of the connection device without compromising the electrical connection or transmitting damaging forces to the contact pad.
Solution Approach 2:
The resilient pressure element acts as a cushioning element that anticipates and absorbs thermal expansion and movement before they can cause damage. By being pre-installed in a resilient state, it provides a buffer that accommodates these dimensional changes during operation, protecting the electrical connection from stress and failure.
3Ease of manufacture
If a uniform pressure element is used across the entire substrate, then the manufacturing is simple, but the pressure distribution cannot be optimized for different regions
Solution Approach 1:
The resilient pressure element is designed with spatially varying properties, including regions of different thickness and varying material hardness. This allows different areas of the substrate to receive optimized pressure distributions tailored to their specific requirements, such as higher pressure in critical contact areas and lower pressure in sensitive regions, while still being manufactured as an integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more controlled and flexible pressure application onto power semiconductor components and the connection device, enhancing the reliability and efficiency of the power electronic circuit device while minimizing potential damage.
Implementation Method 1
a two-dimensional resilient pressure element having pressure element sections, wherein first pressure element sections (52) press with respective first pressure surface sections (520) onto an assigned contact section (32) and a second pressure element section (54) presses with a second pressure surface section (540) onto a lower section or the entire connecting section (34)
Implementation Method 2
first pressure element sections (52) press with respective first pressure surface sections (520) onto an assigned contact section (32) and a second pressure element section (54) presses with a second pressure surface section (540) onto a lower section or the entire connecting section (34)
Data Source
AI summary
A power electronic circuit device has a substrate, with multiple conductive tracks, and a power semiconductor component on these conductive tracks has a connection device with a metal sheet which electrically connects a contact pad of the power semiconductor component to a contact pad of a further power semiconductor component or a conductive track, and has a pressure device. The connection device includes a contact section for connection to an assigned contact pad and a connecting section arranged between the two contact sections. The pressure device includes a two-dimensional resilient pressure element that comprises pressure element sections, and first pressure element sections press with a first pressure surface section onto a contact section and second pressure element section presses with a second pressure surface section press onto the connecting section.