Resilient Receiving Member for Thermocompression Bonding
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Solution Overview
Problem
Existing thermocompression bonding methods for connecting flexible and rigid substrates in high-density electronic components require precise control of compression-bonding load, leading to complex equipment structures and increased costs, which complicates the achievement of stable connection quality.
Innovation Solution
A substrate backing device with a resilient receiving member that applies a supporting counterforce during thermocompression bonding, allowing for stable connection without precise pressing-force control, using a simple structure that includes a backing plate with an opening portion and a height reference to support the substrates effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise control of compression-bonding load is implemented to ensure high-level reliability of connection, then connection reliability is improved, but device complexity and equipment cost significantly increase
Solution Approach 1:
The resilient member automatically adjusts to the substrate surface contour and provides self-regulating compression force during thermocompression bonding. The member's elastic deformation naturally adapts to surface variations, eliminating the need for complex external control mechanisms while maintaining reliable solder connections.
Solution Approach 2:
The resilient member changes its physical state from a relaxed position to a compressed state during bonding, automatically adjusting the compression force parameter. This elastic deformation allows the system to maintain optimal bonding pressure without requiring precise external control of compression parameters.
2Manufacturing precision
If precise pressing-force control is implemented during thermocompression bonding, then connection quality is stabilized, but equipment cost and structure complexity increase
Solution Approach 1:
The resilient member is pre-configured to provide cushioning force that compensates for surface irregularities before actual bonding occurs. This prior cushioning ensures uniform contact and distribution of compression force across the bonding area, stabilizing connection quality without requiring complex real-time control systems.
Solution Approach 2:
The resilient member acts as an intermediary between the compression source and the substrate, mediating the force transmission. It absorbs and distributes compression force uniformly across the bonding area, eliminating the need for complex pressing-force control mechanisms while ensuring stable connection quality.
3Manufacturing precision
If the resilient member structure is added to the backing plate, then supporting counterforce uniformity is improved and precise pressing-force control is eliminated, but device structure becomes more complex
Solution Approach 1:
The compression control function is extracted from the main thermocompression-bonding device and transferred to a simple resilient member on the backing plate. This separation allows the main device to remain simple while the resilient member provides the necessary uniform supporting counterforce through its elastic properties.
Solution Approach 2:
The resilient member is positioned specifically at the bonding area on the backing plate, providing localized support and counterforce uniformity where it is most needed. This local implementation maintains overall device simplicity while achieving precise force distribution at the critical bonding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stabilized connection quality with reduced equipment costs and improved uniformity of the supporting counterforce, accommodating the convexity and concavity of the substrates, thus enhancing the bonding process.
Implementation Method 1
a receiving member (5) which comes into contact with the lower surface of the first substrate (6) in an area coincident with the compression bonding area and applies, to the first substrate (6), an upward supporting counterforce corresponding to the pressing force
Implementation Method 2
the conductive adhesive agent is preliminarily provided on the circuit electrodes, and the flexible substrate is thermocompressively bonded to the rigid substrate with a thermocompression-bonding device. Through this thermocompression bonding, it is possible to establish electrical conduction between the circuit electrode and the terminal through the conductive particles sandwiched between the circuit electrode and the terminal. Further, through the thermosetting resin having been thermally cured during the thermocompression bonding, it is possible to bond the flexible substrate and the rigid substrate to each other.
Data Source
AI summary
A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.