Resilient Split Ring Terminal for BGA Interchangeability

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Solution Overview

Problem

Ball grid array (BGA) packages are difficult to replace or interchange once soldered to a printed circuit board, limiting their flexibility and testing capabilities.

Innovation Solution

A connector assembly with resilient terminal assemblies that allow for non-permanent electrical connection between BGA packages and printed circuit boards, enabling interchangeability and high-density, low-profile connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If BGA packages are soldered directly to printed circuit board, then electrical connection reliability is improved, but interchangeability and replaceability deteriorate

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidinterchangeability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

A socket assembly with terminal assemblies acts as an intermediary component between the BGA package and the printed circuit board. The terminal assemblies provide removable electrical connections, allowing the BGA package to be interchangeably connected to the PCB through the socket, thus maintaining reliability while enabling replaceability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The connection system is segmented into three separate components: the BGA package, the socket assembly with terminal assemblies, and the printed circuit board. This segmentation allows the BGA package to be independently removed and replaced while the socket remains on the PCB, resolving the contradiction between reliable connection and interchangeability.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If terminal density is increased, then connection density is improved, but manufacturing complexity deteriorates

Engineering Contradiction:
Improveterminal densityVSAvoidmanufacturing complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The terminal assembly employs a nested structure where the resilient body is received within a cavity of the insulating support member, and terminals are disposed within the resilient body. This nested arrangement achieves high terminal density in a compact space while maintaining manufacturability through standardized assembly processes.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Length of moving object

If profile height is reduced, then space efficiency is improved, but mechanical strength deteriorates

Engineering Contradiction:
Improveprofile heightVSAvoidmechanical strength
Core Design Contradiction:
Length of moving objectVSStrength

Solution Approach 1:

The resilient body is formed as a thin-walled hollow cylindrical structure that provides radial resiliency while maintaining axial compactness. This flexible shell structure achieves the desired low profile while the resiliency provides the necessary mechanical strength for electrical connections.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The resilient body incorporates dynamic characteristics through its ability to radially expand and contract, allowing the terminal assembly to accommodate manufacturing tolerances and thermal expansion while maintaining low profile. The radial resiliency compensates for the reduced axial height, preserving mechanical strength.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable, high-frequency operation with increased terminal density and low profile, allowing for efficient intercoupling of BGA packages without permanent attachment, facilitating testing and maintenance.

Implementation Method 1

Each terminal assembly includes a hollow cylindrical body, the body including a first end, a second end opposed to the first end, and a longitudinal axis, the body configured to be radially resilient. The resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS8147253B2Split ring terminal assembly
Publication Date: 2012.04.03 ADVANCED INTERCONNECTIONS CORP
  • US8147253B2 patent drawing
  • US8147253B2 patent drawing
  • US8147253B2 patent drawing

AI summary

A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.