Resilient Thermal Structure for IC Package Heat Dissipation
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Solution Overview
Problem
Integrated circuit packages face challenges in reducing dimensions, improving thermal performance, and lowering costs while managing increasing heat generation due to higher power consumption and density, with existing solutions like heat slugs and thermally enhanced ball grid array packages offering limited improvements.
Innovation Solution
The integration of a resilient thermal structure, such as a coil-type spacer, between the integrated circuit die and a heat slug, which acts as a thermal path and spacer, enhancing heat dissipation and providing a more reliable thermal conduction contact, while also serving as a buffer against molding process stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more integrated circuits are integrated into a package, then functionality increases, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by stacking heat slugs vertically between the integrated circuit and heat sink, creating multiple thermal pathways in the vertical dimension. This allows heat to be conducted through multiple layers simultaneously, effectively managing thermal loads from multiple integrated circuits stacked in the same package.
Solution Approach 2:
The heat management system is segmented into multiple discrete heat slugs, each thermally coupled to a specific integrated circuit die. This segmentation allows independent thermal management for each heat-generating component, enabling optimized heat dissipation pathways for each circuit while maintaining close thermal coupling through the resilient thermal structure.
2Temperature
If heat slug size is increased to improve thermal performance, then heat dissipation improves, but package height increases
Solution Approach 1:
The patent employs a resilient thermal structure that provides dynamic, compliant thermal contact between the heat slug and the integrated circuit die. This resilient connection allows the heat slug to maintain optimal thermal coupling under varying conditions without requiring excessive height, as the resilience compensates for manufacturing tolerances and assembly variations, enabling effective heat dissipation within compact dimensions.
3Ease of manufacture
If conventional epoxy molding compound is used for package protection, then manufacturing is simplified, but thermal performance deteriorates
Solution Approach 1:
The resilient thermal structure acts as an intermediary between the integrated circuit die and the heat slug, providing a thermally conductive pathway that bridges the gap created by using conventional epoxy molding compound. This intermediary component compensates for the poor thermal conductivity of the EMC by establishing direct, high-conductivity thermal contact paths through the resilient material to the heat slug.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat transfer from the integrated circuit die to the heat slug, offering better thermal performance and reliability compared to conventional solutions, while supporting cost reduction and increased chip density.
Implementation Method 1
thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die
Implementation Method 2
serving as a buffer against molding process stresses
Data Source
AI summary
An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure.