Resilient Waterproof Element for Circuit Board Sealing
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Solution Overview
Problem
Conventional electronic devices face challenges in achieving waterproofing without occupying significant space, especially in small devices, and the insert molding process for waterproof covers is costly.
Innovation Solution
A waterproof element made of resilient material with a main body providing upward, downward, and sideward abutments to the circuit board, ensuring effective sealing without requiring substantial space, using a simple structure that reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a waterproof dustproof cover is used to cover the connecting ports, then waterproofing and dustproofing are achieved, but the casing requires sufficient space to accommodate the cover
Solution Approach 1:
The patent merges the waterproof cover function with the circuit board assembly by making the circuit board itself waterproof and integrating the connecting port directly onto the circuit board. This eliminates the need for a separate waterproof dustproof cover, thereby achieving waterproofing while reducing the space required in the casing.
Solution Approach 2:
The patent extracts the waterproof cover as a separate component and eliminates it by making the circuit board inherently waterproof. The connecting port is also extracted from the casing and integrated directly onto the circuit board, removing the need for additional waterproofing structures.
2Reliability
If the I/O connecting device and portion of the casing are made by an insert molding process, then waterproofing is achieved, but the manufacturing cost is high
Solution Approach 1:
The patent combines the circuit board and connecting port into a single integrated assembly where the connecting port is directly mounted on the circuit board. This integration simplifies the manufacturing process by eliminating the need for complex insert molding operations and reduces the number of assembly steps, thereby lowering manufacturing costs while maintaining waterproofing.
3Object-affected harmful factors
If a conventional waterproof dustproof cover is used, then connecting ports are protected from dust and liquid, but the structure becomes complex and occupies substantial space
Solution Approach 1:
The patent merges the protective function into the circuit board assembly itself by making the circuit board waterproof and integrating the connecting port directly onto it. This eliminates the need for separate covers and complex sealing structures, thereby reducing structural complexity while maintaining protection from dust and liquid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a good waterproof effect while minimizing space occupation and manufacturing costs, ensuring the electronic device remains protected from liquids without complex designs.
Implementation Method 1
The waterproof element is made of a resilient material, and includes a main body that is disposed on the accommodating portion
Data Source
AI summary
An electronic device includes a housing unit having an accommodating portion, and first and second openings communicating with the accommodating portion. A waterproof element is made of a resilient material, and includes a main body that is disposed on the accommodating portion and that has a top face, and a side face extending upwardly from the top face. The electronic component module includes a circuit board and an electronic component. The circuit board has a board bottom face disposed on and abutting against the top face of the main body and covering the second opening, and a board edge abutting against the side face of the main body. An electronic component is attached to the circuit board, extends through the main body of the waterproof element, is disposed inside the accommodating portion, and faces the first opening.