Radiation-Sensitive Resin Composition for MEEF Control

Solution Overview

Problem

Current radiation-sensitive resin compositions face challenges in achieving precise control of fine patterns and improved MEEF (Mask Error Enhancement Factor) performances, particularly in the miniaturization of semiconductor and liquid crystal devices, where accurate line width control and pattern configuration are critical.

Innovation Solution

A radiation-sensitive resin composition incorporating a compound with a specific structural unit having an acid-labile group and a polymer with a structural unit that includes a lactone or cyclic carbonate structure, enhancing the affinity and polarity to control acid diffusion effectively, thereby improving MEEF performances and pattern formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional chemically amplified resist composition is used, then general characteristics such as resolving performances and sensitivity are achieved, but accurate control of fine shapes and MEEF performances deteriorates

Engineering Contradiction:
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent introduces a specific compound with sulfonic acid group and onium cation that generates carboxylic acid upon exposure, changing the chemical parameters of the resist system to achieve better MEEF performance and fine shape control while maintaining resolving performance and sensitivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resist composition containing the novel compound of formula (1) combined with a polymer having acid-labile groups, forming a multi-component system that achieves both accurate line width control and improved MEEF performances

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If basic compound is added to prevent acid diffusion, then fine shape control improves, but overall pattern configuration and MEEF performances still need improvement

Engineering Contradiction:
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the approach from adding basic compounds to using a compound that generates carboxylic acid upon exposure, fundamentally altering the chemical mechanism to achieve both fine shape control and improved pattern configuration through the specific molecular structure of formula (1)

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The compound of formula (1) acts as an intermediary that generates carboxylic acid in situ, mediating between the exposure light and the polymer to achieve precise pattern formation and improved MEEF performance without requiring additional basic compounds

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves superior sensitivity, resolving ability, and MEEF performances, enabling the formation of finer patterns with improved adhesiveness and substrate interaction, thus addressing the limitations of existing chemically amplified resist compositions.

Implementation Method 1

a radiation-sensitive acid generating agent having a trifluoromethanesulfonyl structure, a radiation-sensitive acid generating agent having a sulfonyl structure

Methodology Applied
Scientific EffectPhotoacid generation: Photodissociation

Implementation Method 2

a resin component whose solubility in developer solutions varies by the action of this acid

Methodology Applied
Scientific EffectAcid-labile group decomposition: Photodissociation

Implementation Method 3

enhancing the affinity and polarity to control acid diffusion effectively

Methodology Applied
Scientific EffectAcid diffusion control: Diffusion

Data Source

PatentUS9304393B2Radiation-sensitive resin composition and compound
Publication Date: 2016.04.05
  • US9304393B2 patent drawing
  • US9304393B2 patent drawing
  • US9304393B2 patent drawing

AI summary

A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that includes a structural unit having an acid-labile group. R1 and R4 each independently represent a hydrogen atom, or the like. R2 and R3 each independently represent a hydrogen atom or the like. X1 and X2 each independently represent a hydrogen atom, or the like, or X1 and X2 taken together represent —S—, —O—, —SO2—, or the like. A represents an ethanediyl group, wherein at least one hydrogen atom included in X1, X2 and A is substituted by —Y—SO3−M+. Y represents an alkanediyl group having 1 to 10 carbon atoms, or the like. M+ represents a monovalent onium cation. In the case where —Y—SO3−M+ is present in a plurality of number, a plurality of Ys are each identical or different and a plurality of M+s are each identical or different.