Resin Composition Low-Temperature Curing Adhesive
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Solution Overview
Problem
Existing one-part adhesives for electronic components, such as image sensor modules, face challenges in curing at low temperatures while minimizing volatile components that can contaminate sensors and lenses, leading to reliability issues and increased production costs.
Innovation Solution
A resin composition comprising 2-methylene-1,3-dicarbonyl compounds with specific molecular weights and structural units, which allows for thermal curing at 80°C or lower temperatures with minimal volatile components, forming a cross-linked structure for enhanced mechanical properties and reduced contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional one-part adhesives (thiol-based or acrylate resin-based) are used for low-temperature curing, then curing at 80°C is achieved, but manufacturing efficiency is insufficient and volatilization issues persist
Solution Approach 1:
The patent changes the chemical parameters of the adhesive system by using 2-methylene-1,3-dicarbonyl compounds with specific molecular weights (220-10,000) and structural units (formula I), enabling curing at 80°C or lower while achieving sufficient curing speed for manufacturing efficiency
Solution Approach 2:
The patent creates a composite adhesive system combining 2-methylene-1,3-dicarbonyl compounds with specific molecular weight ranges and structural units, achieving synergistic effects that enable both low-temperature curing and acceptable manufacturing efficiency
2Speed
If adhesives with low molecular weight components are used for low-temperature curing, then curing reactivity is improved, but volatilization increases causing contamination of sensors and lenses
Solution Approach 1:
The patent optimizes the molecular weight parameter to a specific range (220-10,000) and defines structural units (formula I) that balance reactivity and volatility, achieving fast curing while minimizing harmful volatilization that causes contamination
Solution Approach 2:
The patent applies different molecular weight ranges and structural unit compositions to different applications, allowing optimization of reactivity versus volatility based on specific manufacturing requirements
3Temperature
If low molecular weight components are present in high amounts, then low-temperature curing is facilitated, but adhesion strength decreases due to bubble formation from volatilization
Solution Approach 1:
The patent changes the molecular weight parameter to 220-10,000 and specifies structural units (formula I) that reduce excessive volatilization, preventing bubble formation while maintaining low-temperature curing capability and preserving adhesion strength
4Reliability
If conventional adhesives are used, then curing at moderate temperatures is achieved, but heat-induced deterioration of neighboring components occurs
Solution Approach 1:
The patent changes the chemical composition parameters to use 2-methylene-1,3-dicarbonyl compounds with specific molecular weights and structural units, enabling curing at 80°C or lower to prevent heat-induced deterioration of sensitive electronic components while maintaining reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables efficient low-temperature curing with reduced volatile components, improving manufacturing efficiency, maintaining component reliability, and minimizing contamination, thus ensuring high adhesion strength and environmental safety.
Implementation Method 1
a resin composition which comprises one or more 2-methylene-1,3-dicarbonyl compounds, wherein at least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000
Implementation Method 2
forming a cross-linked structure for enhanced mechanical properties
Data Source
Figure 1
AI summary
An object of the present invention is to provide a resin composition that is curable at a low temperature of 80°C or lower, preferably at room temperature, and that only contains a small amount of components that volatilize during use (application) or curing and is suitable as a one-part adhesive for use in the manufacture of an image sensor module or an electronic component. The resin composition of the present invention contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.