Resin Adhesive Spread Control via Frame-Shaped Glass Layer
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Solution Overview
Problem
In electronic components with sealed structures, resin adhesives used for bonding sealing members tend to spread before curing, often adhering to peripheral edges and causing mount failure due to the difference in surface roughness between the adhesive and the substrate.
Innovation Solution
A frame-shaped glass layer is introduced between the outer peripheral line of the bonding region and the peripheral edge of the sealing member, with a thickness greater than the resin adhesive layer, to suppress the spread of the adhesive by leveraging surface tension and reducing surface roughness differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin adhesive is used to bond sealing members, then bonding strength is achieved, but the adhesive spreads before curing and adheres to peripheral edges causing mount failure
Solution Approach 1:
A frame-shaped glass layer is introduced as an intermediary between the resin adhesive and the alumina substrate. This glass layer acts as a barrier that prevents the adhesive from spreading to the peripheral edges while still allowing effective bonding to occur within the bonding region, thus resolving the contradiction between bonding strength and mount reliability
Solution Approach 2:
The glass layer is applied locally in a frame shape at the peripheral regions where adhesive spread is problematic, rather than uniformly across the entire substrate. This localized application allows the adhesive to bond effectively in the central bonding region while preventing spread at the edges, addressing the reliability issue without compromising bonding strength
2Strength
If the surface roughness of the substrate is high, then bonding area is increased, but the adhesive spreads more before curing
Solution Approach 1:
The glass layer is applied locally in a frame shape at the peripheral regions where adhesive spread is problematic, rather than uniformly across the entire substrate. This localized application allows the adhesive to bond effectively in the central bonding region while preventing spread at the edges, addressing the reliability issue without compromising bonding strength
Solution Approach 2:
A frame-shaped glass layer is introduced as an intermediary between the resin adhesive and the alumina substrate. This glass layer acts as a barrier that prevents the adhesive from spreading to the peripheral edges while still allowing effective bonding to occur within the bonding region, thus resolving the contradiction between bonding strength and mount reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the resin adhesive from spreading to the peripheral edges during curing, enhancing the reliability of electronic component mounting and maintaining bonding strength while minimizing mount failure risks.
Implementation Method 1
to suppress the spread of the adhesive by leveraging surface tension and reducing surface roughness differences
Data Source
AI summary
A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.