Resin Base Component Mounting With Solder-Resin Interlayer Bonding
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Solution Overview
Problem
The challenge in mounting electronic components on flexible base materials with conductive paste wiring or electrodes is the inhibition of solder wetting due to resin components, leading to potential disconnection issues, as the conductive filler diffuses into the solder.
Innovation Solution
A method involving a resin base material with a conductive paste wiring pattern, where a solder paste containing solder particles and a thermosetting resin is applied and heated to melt the solder particles and initiate a curing reaction of the thermosetting resin, forming a solder bonding portion and a cured resin interlayer, which enhances bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder paste is applied directly to conductive paste wiring on resin base material, then electrical connection is achieved, but solder wetting is inhibited and conductive filler diffuses into solder causing disconnection
Solution Approach 1:
A plating layer made of solderable metal (such as Sn, Ag, or Cu) is formed as an intermediary between the conductive paste wiring and the solder paste. This plating layer prevents the resin component from inhibiting solder wetting and stops conductive filler from diffusing into the solder, thereby ensuring reliable electrical connection without the harmful effects of direct contact between solder and conductive paste
Solution Approach 2:
The solution creates a composite structure consisting of multiple layers: the resin base material, conductive paste wiring, plating layer, and solder paste. This composite material approach combines the advantages of each layer while mitigating their individual disadvantages, particularly using the plating layer to protect both the conductive paste and solder from adverse interactions
2Reliability
If metal plating layer is formed on conductive paste to improve solder wetting, then solder bonding reliability improves, but manufacturing process complexity increases
Solution Approach 1:
The plating layer formation process is merged with the existing conductive paste printing and drying process. By applying the plating material over the conductive paste and drying it together in the same thermal processing step, the plating layer is formed without requiring a separate manufacturing process, thus improving solder bonding reliability while minimizing increases in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reinforces the bonding strength between the base material and the electronic component by creating a thermosetting resin interlayer, ensuring a stable electrical connection and mechanical adhesion, suitable for flexible electronic devices like wearable technology.
Implementation Method 1
heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles
Implementation Method 2
starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive
Data Source
AI summary
A method for mounting an electronic component on a resin base material, the method including:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;(3) placing the electronic component on the solder paste; and(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, whereina melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.