Resin Board Current Terminal for High-Speed X-Ray Imaging

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Solution Overview

Problem

Conventional current introduction terminals struggle to achieve high-speed signal transfer and space-saving high-density wiring for X-ray imaging apparatuses, particularly due to limitations in mechanical strength, insulation, and high-frequency characteristics, making them unsuitable for high-resolution X-ray image sensors.

Innovation Solution

A current introduction terminal using a resin insulating board with through via holes filled by a predetermined material and covered by metal pads, allowing for high-density signal transfer while maintaining airtightness, and featuring a design that facilitates easy manufacturing and flexibility in connector selection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional current introduction terminals are used, then airtightness is maintained, but signal transfer speed and wiring density are limited

Engineering Contradiction:

Improvesignal transfer speedVSAvoidairtightness

Core Design Contradiction:

SpeedVSReliability

Solution Approach 1:

The terminal structure is divided into multiple layers (first terminal layer, second terminal layer, intermediate layer) with through-via holes penetrating through them. This segmentation allows high-density signal routing while maintaining airtightness through coordinated sealing at each layer interface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The terminal structure combines metal materials (for electrical conductivity and strength) with resin materials (for insulation and sealing). This composite approach enables both high-speed signal transfer and reliable airtight sealing simultaneously.

Inventive Principle:

Principle #40Composite materials

2Area of stationary object

If high-density wiring is implemented, then space is saved, but manufacturing complexity increases

Engineering Contradiction:

Improveterminal areaVSAvoidmanufacturing ease

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The terminal structure utilizes three-dimensional space by stacking multiple terminal layers with through-via holes connecting them. This vertical arrangement achieves high wiring density without increasing the horizontal footprint, and the modular layer structure simplifies manufacturing compared to planar high-density routing.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Strength

If metal chamber is used for pressure difference, then structural strength is ensured, but electrical insulation becomes challenging

Engineering Contradiction:

Improvechamber strengthVSAvoidelectrical insulation

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The terminal structure introduces resin materials as intermediary insulating layers between metal components and around through-via holes. This intermediary approach maintains the structural strength of the metal chamber while providing reliable electrical insulation for high-density signal routing.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11470722B2Current introduction terminal, and pressure holding apparatus and X-ray image sensing apparatus therewith

Publication Date: 2022.10.11 RIKEN CO LTD

AI summary

A current introduction terminal includes a board made of resin. The board has a first face and a second face opposite each other. The board hermetically separates environments of different air pressures from each other. A plurality of through via holes corresponding both to a plurality of metal terminals of a first surface-mount connector to be mounted on the first face and to a plurality of metal terminals of a second surface-mount connector to be mounted on the second face are formed to penetrate between the first and second faces, and then hole parts of the through via holes are filled with resin.