Resin Branch Filling Structure for Multi-Substrate Sensor Housings
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Solution Overview
Problem
In electronic apparatuses where substrates with electronic components are mounted in a case filled with hot-melt resin, variations in assembly and resin flow stress cause gaps between the wall part and the case, leading to inadequate protection and design restrictions, especially when multiple substrates are used, resulting in poor voltage and water resistance.
Innovation Solution
The electronic apparatus employs a fluid branch member to divide the case into multiple spaces, allowing thermoplastic hot-melt resin to be filled independently through branching flow paths, ensuring complete coverage of substrates and improved resistance properties by minimizing unfilled areas and air bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a wall part is provided on the substrate to control the flow end part of the hot-melt resin, then the resin filling is improved, but gaps are generated between the wall part and the case due to assembly variations and substrate bending, leading to poor voltage and water resistance
Solution Approach 1:
The patent introduces a resin guide structure as an intermediary component between the substrate and the case. This guide structure controls the resin flow path and flow end part without requiring direct attachment to the substrate, thereby avoiding gaps that would compromise voltage and water resistance while ensuring complete resin filling.
Solution Approach 2:
The invention segments the resin filling control function by providing multiple resin guide structures at different locations. Each guide structure independently controls the resin flow in its respective region, allowing precise control of the flow end part without requiring a single complex wall part that would be susceptible to assembly variations.
2Adaptability or versatility
If multiple substrates are used in the electronic apparatus, then functional complexity is increased, but the flow of hot-melt resin becomes complicated requiring multiple wall parts, causing excessive restrictions on substrate design
Solution Approach 1:
The resin guide structures are designed as universal components that can be applied to various substrate configurations including single substrate and multiple substrate arrangements. The same basic guide structure design serves multiple functions: controlling resin flow, defining flow end parts, and accommodating different substrate layouts without requiring fundamentally different designs.
3Reliability
If the case is filled with hot-melt resin to protect the substrate, then protection is improved, but poor filling occurs when there is a thick part in the cavity, leading to inadequate coverage
Solution Approach 1:
The resin guide structures are positioned in advance within the case before resin injection. These pre-positioned guides create defined flow paths that direct the hot-melt resin toward thick parts of the cavity, ensuring that resin reaches and fills these difficult-to-access areas before the resin begins to cool and solidify.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances voltage and water resistance by ensuring thorough resin coverage of substrates and minimizing unfilled areas, even in complex substrate arrangements, while allowing for efficient resin flow and reduced heat damage during manufacturing.
Implementation Method 1
a thermoplastic hot-melt resin filled in the case... a flow path part for branching the thermoplastic hot-melt resin into multiple parts and guiding the thermoplastic hot-melt resin from the opening to the plurality of spaces
Data Source
AI summary
An electronic apparatus includes, in a case, substrates with electronic components mounted thereon, a thermoplastic hot-melt resin, and a fluid branch member, wherein: the inside of the case is divided into a plurality of spaces; the plurality of spaces are at least any space among spaces between the case and the substrates and spaces between the substrates, and are filled with the thermoplastic hot-melt resin; and the fluid branch member is provided with an opening as an inlet for the thermoplastic hot-melt resin, and flow path parts for branching the thermoplastic hot-melt resin into multiple parts and guiding the same.