Resin Cap Alignment for Semiconductor Optical Devices
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Solution Overview
Problem
In semiconductor optical devices, particularly CAN packages, the alignment and securement of a resin cap with a stem is challenging due to limited space, and existing techniques that use steps and recesses reduce the area available for mounting components.
Innovation Solution
A semiconductor optical device design featuring a resin cap with a cylindrical body and projections that engage with the stem's corresponding features, allowing for accurate alignment and securement while maximizing the interior space by using adhesive bonding and strategically positioned recesses and projections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If steps and recesses are provided on the cap and stem for alignment, then alignment accuracy is improved, but the area available for mounting components is reduced
Solution Approach 1:
The invention transitions from using steps and recesses (horizontal dimension) for alignment to using protrusions and grooves (vertical dimension) for alignment. The grooves extend in the vertical direction from the bottom surface of the cap, allowing alignment features to be positioned below the mounting surface, thus resolving the conflict between alignment accuracy and component mounting area.
Solution Approach 2:
The alignment features (protrusions and grooves) are nested within the structure of the cap and stem, with the grooves extending downward from the bottom surface. This nesting allows the alignment function to be embedded within the existing structure without occupying additional horizontal space that would be needed for component mounting.
2Ease of manufacture
If the cap is made of resin and bonded by adhesive, then welding is avoided, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The invention segments the alignment function from the bonding function. The protrusions and grooves provide mechanical alignment, while the adhesive provides bonding. This segmentation allows each function to be optimized independently, maintaining alignment precision even with adhesive bonding of resin materials.
Solution Approach 2:
The protrusions and grooves act as intermediaries that facilitate precise alignment between the cap and stem before adhesive bonding. These mechanical features guide the positioning, ensuring alignment precision is achieved even though the final bonding is done with adhesive rather than welding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables precise alignment and securement of the cap relative to the stem, ensuring accurate positioning of the lens with respect to the semiconductor optical element, while maximizing the internal space available for components, thus enhancing the device's performance and efficiency.
Implementation Method 1
The edge portion has a lower surface bonded to the stem
Data Source
AI summary
A semiconductor optical device includes a stem; a semiconductor optical element mounted on the stem; a resin cap including a cylindrical body portion, a plate portion, and an edge portion; and a lens attached integrally to the plate portion of the cap. The edge portion of the cap is bonded to the stem so that the cap covers the semiconductor optical element. The cylindrical body portion of the cap has at least one first portion and second portions which are spaced apart from each other in the circumferential direction of the cylindrical body portion and which project inwardly relative to the at least one first portion. The stem has projections, and each projection vertically underlies and engages or contacts a surface of a respective one of the second portions of the cap.