Resin Cap Engraving for Memory Card Yield
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Solution Overview
Problem
The use of soft resin caps in thin-type memory cards leads to ink bleed issues, resulting in marking defects and decreased production efficiency, as these cards are frequently inserted and extracted from connectors, causing wear and tear on the resin material.
Innovation Solution
The implementation of a semiconductor device with a resin case body having a first and second body part, where the second body part is thicker and used for engraving product information, preventing ink bleed and eliminating the need for an ink-marking process, thereby enhancing process yield and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a soft resin material is used for the cap to maintain strength and prevent deformation, then the cap can withstand repeated insertion and extraction operations, but ink marking defects occur due to ink bleed on the soft resin surface
Solution Approach 1:
The patent replaces the ink marking process with a laser marking process. The laser beam directly marks the cap surface without requiring ink, thereby eliminating ink bleed issues while maintaining marking quality. This substitution of mechanical/chemical marking system with an optical energy-based system resolves the contradiction between using soft resin for strength and achieving precise marking.
2Loss of information
If an ink marking process is used to print product information on the cap, then product identification is achieved, but production efficiency deteriorates due to additional process steps and marking defects
Solution Approach 1:
The patent replaces the multi-step ink marking process with a direct laser marking process. This eliminates the need for ink application, drying, and quality inspection steps, thereby reducing production time and improving efficiency while ensuring accurate product information marking without defects.
Solution Approach 2:
The patent extracts and eliminates the ink marking step from the manufacturing process, retaining only the essential function of marking product information. By removing the problematic ink application step and replacing it with laser marking, the process becomes more efficient and reliable.
3Manufacturing precision
If a hard resin material is used for the cap to improve marking quality, then ink marking becomes easier, but the connector resin undergoes wear and tear due to friction during insertion and extraction
Solution Approach 1:
The patent replaces ink-based marking with laser marking, which works effectively on soft resin surfaces without requiring the surface to be hard. This allows the use of soft resin for the cap (reducing connector wear) while still achieving high-quality marking through the laser process.
Data Source
AI summary
A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).