Resin Semiconductor Case Electrode Cutout Air Bubble Management
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Solution Overview
Problem
In semiconductor devices, air bubbles between electrodes and resin cases can lead to defects such as decreased insulation when exposed to high temperatures, and existing configurations fail to effectively address this issue.
Innovation Solution
The semiconductor device incorporates a resin case with a section of the electrode featuring cutouts that allow the resin to be exposed, facilitating the movement of air bubbles away from the boundary and preventing their expansion, thereby maintaining insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the case is made of resin for ease of manufacture and cost reduction, then manufacturing cost and ease of production are improved, but adhesion between the electrode and case deteriorates, causing air bubbles to form
Solution Approach 1:
The patent applies local quality by creating a resin protrusion at a specific location where the electrode contacts the case. This localized resin extension improves adhesion precisely at the electrode-resin interface without changing the entire case structure, thereby maintaining ease of manufacture while solving the adhesion problem.
2Reliability
If the inside of the case is filled with sealing resin to seal the electrode, then sealing performance is improved, but air bubbles become trapped between the electrode and case, causing insulation defects
Solution Approach 1:
The patent applies preliminary action by forming the resin protrusion before the electrode is fully positioned and before sealing resin is applied. This pre-formed structure creates a pathway that allows air bubbles to escape during the sealing process, preventing trapped air defects while maintaining effective sealing.
Solution Approach 2:
The resin protrusion acts as an intermediary structure between the electrode and the case body. It provides a controlled interface that facilitates air bubble release during sealing while maintaining the seal integrity, thus mediating between the sealing requirement and the air bubble prevention requirement.
3Device complexity
If air bubbles exist between the electrode and case, then manufacturing simplicity is maintained, but insulation performance deteriorates under high temperature conditions
Solution Approach 1:
The patent applies local quality by creating a specific resin protrusion structure at the electrode-resin interface. This localized modification provides a pathway for air bubble release without complicating the overall device structure, thus maintaining manufacturing simplicity while improving insulation performance under high temperature conditions.
Data Source
AI summary
A semiconductor device includes a case enclosing a region filled with a sealing material. The case is made of resin. An electrode is fixed to the case. A section, which is a part of the electrode, is provided with a cutout that allows a part of the resin making the case to be exposed to the region.