Resin-Closed PCB Through-Holes for Direct Component Embedding
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Solution Overview
Problem
Conventional methods for manufacturing component carriers, such as printed circuit boards, require temporary supporting structures that need to be removed, leading to inefficiencies and potential microcracks, and involve adhesive residues that complicate the process.
Innovation Solution
A method where a core structure with through holes is closed by a non-removable resin layer, which is cured to form a protective and supporting resin shell, eliminating the need for temporary supporting structures and reducing the risk of misalignment and microcracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a temporary supporting structure is used to fix the core structure during manufacturing, then the core structure can be stabilized during the lamination process, but adhesive residues remain on contact faces requiring additional cleaning processes
Solution Approach 1:
The invention removes the temporary supporting structure entirely from the manufacturing process. Instead, a resin layer is applied directly to the core structure without requiring any temporary support, eliminating the source of adhesive residues and the need for cleaning processes.
Solution Approach 2:
The resin layer serves as an intermediary material that performs the stabilizing function previously requiring a temporary supporting structure. The resin layer is applied to the core structure and provides the necessary stability during lamination without leaving harmful residues.
2Stability of the object's composition
If a temporary supporting structure is used to fix the core structure, then the core structure is stabilized during lamination, but the manufacturing process becomes less efficient due to removal and cleaning steps
Solution Approach 1:
The temporary supporting structure is completely extracted from the manufacturing process. The resin layer is applied directly to the core structure, eliminating the need for installation and removal of temporary supports, thereby streamlining the manufacturing process and improving productivity.
Solution Approach 2:
The resin layer application creates a continuous useful action throughout the manufacturing process. Instead of interrupting the process for temporary support installation and removal, the resin layer provides continuous stabilization and becomes part of the final product structure.
3Stability of the object's composition
If a temporary supporting structure with adhesive is used, then the core structure can be fixed, but microcracks may form and reliability is reduced
Solution Approach 1:
The resin layer acts as a disposable material that is applied to provide fixing capability during manufacturing and then becomes part of the permanent structure. Unlike temporary adhesive supports that may cause microcracks when removed, the resin layer remains in place and continues to provide support without creating stress concentrations.
Solution Approach 2:
The invention uses composite material construction where the resin layer is integrated with the core structure. This composite approach eliminates the interface between temporary adhesive and substrate that could generate microcracks, creating a more homogeneous and reliable structure.
4Ease of manufacture
If a resin layer is applied directly to the core structure without temporary support, then the manufacturing process is simplified and residues are eliminated, but the core structure needs to be stabilized during lamination
Solution Approach 1:
The resin layer performs multiple functions simultaneously: it stabilizes the core structure during lamination, eliminates the need for temporary supporting structures, and becomes part of the final component carrier structure. This multi-functionality simplifies the manufacturing process while maintaining stability.
Solution Approach 2:
The resin layer is applied in advance to the core structure before lamination, performing the stabilizing function that would otherwise require a temporary supporting structure. This preliminary action eliminates the need for subsequent removal and cleaning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces the risk of microcracks, and enhances the reliability of the component carrier by providing a robust resin shell that stabilizes the components, thereby improving the overall efficiency and reliability of the component carrier.
Implementation Method 1
The component is embedded to the core structure by curing the resin layer, wherein the resin layer forms a resin shell
Data Source
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AI summary
The present invention relates to a method of manufacturing a component carrier (300). The method comprises the step of providing a core structure (101) comprising at least one electrically insulating layer structure (106) and having a through hole (102), a closing the through hole (102) by a resin layer (103) and an attaching a component (210) in the through hole (102) to the resin layer (103). The component (210) is fixed to the core structure (101) by curing the resin layer (103).