Composite Polishing Slurry for High-Rate Resin CMP
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Solution Overview
Problem
Existing polishing slurries do not effectively achieve a high removal rate when polishing objects that include resin, particularly in chemical mechanical polishing processes.
Innovation Solution
A polishing slurry comprising alumina and silica abrasives, where silica abrasives are composed of aggregate particles of colloidal silica with smaller primary particle sizes than alumina, and a specific size relationship between the primary and alumina particles, enhances the removal rate and restricts alumina rolling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional silica abrasives are used for polishing resin-based objects, then the polishing process can be performed, but the removal rate is insufficient
Solution Approach 1:
The patent uses a composite abrasive system combining alumina and silica abrasives with specific size relationships. The alumina abrasives (median size 0.5-2.0 μm) provide primary grinding action on resin, while the silica abrasives (average primary particle size 0.05-0.5 μm) fill in to polish and reduce scratches, creating a synergistic effect that achieves both high removal rate and effective resin polishing
Solution Approach 2:
The patent applies different abrasive sizes and types to different functional needs within the same polishing slurry. Larger alumina particles handle the bulk material removal, while smaller silica particles address surface finishing and scratch reduction, optimizing the polishing performance for different aspects of the resin surface
2Productivity
If alumina abrasives are used to increase removal rate, then polishing efficiency improves, but alumina rolling occurs which reduces effectiveness
Solution Approach 1:
The silica abrasives act as intermediaries between the alumina abrasives and the resin surface. The smaller silica particles fill in the gaps and prevent alumina particles from rolling, while still contributing to the polishing action. This intermediary role of silica resolves the alumina rolling problem while maintaining high removal rate
Solution Approach 2:
The patent carefully controls the size parameters of both abrasives - alumina with median size 0.5-2.0 μm and silica with average primary particle size 0.05-0.5 μm. By optimizing these particle size parameters and their ratio, the slurry achieves maximum grinding force from alumina while the smaller silica particles prevent rolling and enhance surface contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The slurry improves the removal rate and reduces scratches on resin-based polishing objects by leveraging the grinding force of alumina abrasives while minimizing rolling, thus achieving efficient polishing.
Implementation Method 1
The polishing slurry includes alumina abrasives and silica abrasives... the grinding force of alumina abrasives
Implementation Method 2
silica abrasives including aggregate particles composed of a plurality of primary particles of colloidal silica... reduces scratches on resin-based polishing objects
Data Source
Figure 1
AI summary
A polishing slurry according to the present invention is a polishing slurry for polishing a polishing object including a resin, wherein the polishing slurry includes alumina abrasives and silica abrasives, the silica abrasives include aggregate particles composed of a plurality of primary particles of colloidal silica, and an average particle size of the primary particles is smaller than a median size of the alumina abrasives.