Resin-Coated Copper Composition for Low-Loss Circuit Board Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing circuit boards for high-frequency applications face issues with signal transmission loss, adhesion problems between the insulating layer and circuit pattern, electrochemical migration, and reliability concerns such as warping, cracking, and peeling due to the use of insulating layers with low dielectric constants and exposed fillers.
Innovation Solution
A resin composition for semiconductor packages comprising a composite of resin and fillers with specific diameter ranges and content percentages, along with a buffer layer and functional groups for improved adhesion and chemical bonding, minimizing filler exposure and electrochemical migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the surface roughness of the circuit pattern is reduced to prevent conductor loss, then transmission loss is improved, but adhesion between the circuit pattern and the insulating layer is reduced
Solution Approach 1:
The patent introduces a buffer layer with specific surface roughness parameters (Ra: 0.5-5 μm, Rz: 2-20 μm) that differs from both the circuit pattern and the insulating layer. This intermediate parameter set allows the buffer layer to provide mechanical interlocking with the smooth circuit pattern while maintaining chemical adhesion to the insulating layer, thus resolving the contradiction between reducing transmission loss and maintaining adhesion
Solution Approach 2:
The buffer layer acts as an intermediary component between the circuit pattern and the insulating layer. It mediates the conflicting requirements by providing a surface that can adhere to both the smooth metal pattern (through mechanical interlocking) and the insulating layer (through chemical bonding), thereby preventing both transmission loss and adhesion failure
2Loss of energy
If an insulating layer with low dielectric constant is used to reduce signal loss, then transmission performance is improved, but reliability problems such as warping, cracking, and delamination increase
Solution Approach 1:
The patent creates a composite structure consisting of the insulating layer, buffer layer, and circuit pattern. The buffer layer serves as a composite component that combines the benefits of low dielectric constant materials (for signal transmission) with enhanced mechanical properties (for structural stability). This composite approach allows the system to achieve both low signal loss and resistance to warping, cracking, and delamination
Solution Approach 2:
The buffer layer introduces local quality differentiation within the insulating layer structure. By creating a specific region with controlled thickness (5-50 μm) and surface properties, the patent locally enhances adhesion and mechanical strength at the interface between the circuit pattern and the bulk insulating layer, while the bulk material maintains its low dielectric constant for optimal signal transmission
3Loss of energy
If the insulating layer thickness is reduced to minimize warping and improve high-frequency performance, then signal quality is improved, but reliability problems such as bending, cracking, and peeling increase
Solution Approach 1:
The patent changes the thickness parameter of the buffer layer (5-50 μm) to optimize the balance between signal quality and structural integrity. This intermediate thickness allows the buffer layer to provide sufficient mechanical support and adhesion without adding excessive overall thickness to the insulating layer structure, thereby maintaining low signal loss while preventing bending, cracking, and peeling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a reliable circuit board with low dielectric constant and thermal expansion, reducing signal loss and enhancing adhesion, while preventing filler exposure and electrochemical migration, thus improving overall reliability.
Implementation Method 1
a material having a low dielectric constant may be used as an insulating layer of the circuit board in order to reduce a dielectric constant
Implementation Method 2
buffer layer and functional groups for improved adhesion and chemical bonding
Implementation Method 3
a low coefficient of thermal expansion to eliminate cracking due to temperature change
Data Source
AI summary
A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.