Resin Coating and Grinding for Uniform Workpiece Thinning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for coating workpieces with resin using spin coating struggle to achieve uniform thickness and precise surface flattening, which affects the precision of subsequent grinding processes.
Innovation Solution
A workpiece processing apparatus that includes resin coating, curing, and grinding means, utilizing spin coating and UV curing, with integrated thickness measurement and conveyance systems to ensure precise resin film thickness and surface flattening before grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spin coating is used to coat the front surface of the workpiece with liquid resin, then the coating process can be performed, but the thickness of the coated resin cannot be controlled uniformly and the exposed surface cannot be flattened with high precision
Solution Approach 1:
The patent applies preliminary action by performing resin coating on the front surface before the grinding process. The resin is coated and cured to form a protective film that will be ground along with the workpiece back surface, ensuring the devices on the front surface are protected during thinning while maintaining precise thickness control through the integrated measurement and grinding system.
Solution Approach 2:
The patent implements feedback by measuring the thickness of the resin film after coating and before grinding, then using this measured value to control the grinding amount in the subsequent process. This closed-loop feedback ensures that even though spin coating alone cannot achieve uniform thickness, the final resin film thickness can be precisely controlled by adjusting the grinding based on the measured initial thickness.
2Device complexity
If the resin film thickness is not precisely controlled or the surface is not flattened, then the coating process is simple, but the thickness precision of the workpiece during grinding decreases
Solution Approach 1:
The patent uses feedback control by measuring the resin film thickness with a thickness measurement device and transmitting this information to the grinding apparatus. The grinding amount is then adjusted based on the measured thickness, ensuring precise final thickness control regardless of variations in the initial coating process, thus maintaining workpiece thickness precision without overly complicating the coating system.
Solution Approach 2:
The patent introduces an intermediary measurement system that acts as a mediator between the coating process and the grinding process. The thickness measurement device provides intermediate data about the resin film thickness, which is then used to adjust the grinding parameters, ensuring that the final workpiece thickness is precise even when the coating process itself is relatively simple.
3Reliability
If protective tape is attached to the workpiece for grinding, then device protection is achieved, but the need for additional handling and potential contamination increases
Solution Approach 1:
The patent merges the protective function with the grinding process by coating the front surface with resin that is then ground together with the back surface. Instead of using a separate protective tape that would require attachment and removal, the resin coating serves both as protection during grinding and as part of the final product structure, eliminating the need for separate protective measures and reducing handling steps.
Solution Approach 2:
The resin coating serves multiple functions: it protects the devices on the front surface during the grinding of the back surface, and it also becomes part of the final workpiece structure. This multi-functional approach eliminates the need for separate protective tape, reducing device complexity while maintaining reliable protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves a desired resin film thickness and precise surface flattening within the processing apparatus, improving the overall precision of the workpiece thickness after grinding.
Implementation Method 1
the resin coating means coats the front surface of the workpiece with the resin by a spin coating method
Implementation Method 2
resin curing means curing the resin by applying an external stimulus to the coated resin
Implementation Method 3
resin grinding means flattening the cured resin by grinding the cured resin by a rotating grinding stone
Data Source
AI summary
A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.