Resin Complex Layer for Printed Wiring Board Shear Strength
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Solution Overview
Problem
Highly integrated printed wiring boards require enhanced tolerance to external stresses such as heat, vibration, and impact to ensure reliable operation in severe environments, but existing boards often lack sufficient shear strength between pads and terminals, leading to potential joint failure under stress.
Innovation Solution
A multilayer printed wiring board is manufactured with a core substrate, an insulation layer, a resin complex layer comprising thermosetting and thermoplastic resin materials, and a conductive circuit, where the resin complex layer is formed by thermopressing a multi-layered film containing a thermoplastic resin and a thermosetting resin, enhancing adhesion and shear strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a high-density printed wiring board is manufactured using a build-up method with multiple laminated layers, then integration density is improved, but shear strength between pads and terminals deteriorates
Solution Approach 1:
The patent applies composite materials by combining thermoplastic resin and thermosetting resin in a resin complex layer. The thermoplastic resin provides toughness and stress absorption, while the thermosetting resin provides cross-linked strength and thermal stability. This composite structure resolves the contradiction by achieving both high integration density through multi-layer lamination and sufficient shear strength through the synergistic properties of the resin combination.
Solution Approach 2:
The patent changes the physical and chemical parameters of the resin layer by controlling the curing process. The uncured resin layer is transformed into a cured resin complex layer through controlled curing, which develops the mechanical properties needed for high shear strength. This parameter change enables the resin layer to provide both the flexibility needed for high-density routing and the strength needed for reliable joints.
2Adaptability or versatility
If multiple layers are laminated on a substrate to achieve high integration, then functional density is improved, but tolerance to external stresses deteriorates
Solution Approach 1:
The resin complex layer combines thermoplastic and thermosetting resins to create a material with superior stress tolerance. The thermoplastic component provides ductility and ability to absorb mechanical shocks, while the thermosetting component provides dimensional stability and thermal resistance. This composite approach enables the board to maintain high functional density while tolerating external stresses such as heat, vibration, and impact.
Solution Approach 2:
The resin complex layer acts as a cushioning layer between the rigid conductive circuits and the external environment. It absorbs and dissipates external stresses before they can reach the sensitive pad and terminal joints, providing beforehand protection against stress-induced failures in high-density configurations.
3Reliability
If joint strength between pads and terminals is increased to prevent joint breakage, then reliability is improved, but manufacturing complexity deteriorates
Solution Approach 1:
The patent achieves high joint strength through controlled parameter changes during the curing process. By controlling temperature, pressure, and curing time, the uncured resin layer transforms into a cured resin complex with optimized mechanical properties. This approach provides reliable joints without requiring complex additional manufacturing steps, as the strength development occurs during the standard lamination process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin complex layer provides increased tensile strength and shear resistance, effectively mitigating the effects of external stresses, ensuring reliable electrical connections and improved durability for applications in harsh environments like automobiles and cell phones.
Implementation Method 1
a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material
Implementation Method 2
the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material
Data Source
AI summary
A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material, and a conductive circuit is formed over the resin complex layer.