Resin Composition Thermal Conductivity Peel Strength
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Solution Overview
Problem
Current resin compositions for printed circuit boards face challenges in achieving sufficient thermal conductivity and copper foil peel strength while maintaining moisture absorption heat resistance, as high filler content can lead to moldability issues and decreased adhesiveness.
Innovation Solution
A resin composition is developed by blending primary hexagonal boron nitride particles with a specific average aspect ratio of 4 to 10, along with a cyanate compound, maleimide compound, and/or epoxy resin, to enhance thermal conductivity and peel strength while maintaining moisture absorption heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermosetting resin composition is highly filled with an inorganic filler to improve thermal conductivity, then thermal conductivity is improved, but moldability deteriorates and cracks and voids are likely to occur
Solution Approach 1:
The invention changes the particle size distribution parameter of the inorganic filler, specifically using a bimodal distribution with first particles of 0.1-5 μm and second particles of 5-50 μm. This parameter optimization allows high filler content (improving thermal conductivity) while maintaining moldability by reducing cracks and voids through the synergistic packing of different sized particles.
Solution Approach 2:
The invention uses a composite filler system combining two different inorganic filler particles with distinct size ranges. This composite approach creates a more efficient packing structure that maintains both high thermal conductivity and good moldability, avoiding the defects associated with single-size filler systems.
2Temperature
If a thermosetting resin composition is highly filled with an inorganic filler to improve thermal conductivity, then thermal conductivity is improved, but adhesiveness between resin and inorganic filler becomes insufficient and copper foil peel strength decreases
Solution Approach 1:
The invention optimizes the particle size parameters of the inorganic filler, using first particles of 0.1-5 μm and second particles of 5-50 μm. This size optimization improves the surface area to volume ratio and interfacial adhesion, thereby maintaining copper foil peel strength even at high filler contents that improve thermal conductivity.
Solution Approach 2:
The invention applies different filler particle sizes to different functional requirements: smaller particles (0.1-5 μm) provide better interfacial adhesion and copper foil peel strength, while larger particles (5-50 μm) contribute to thermal conductivity. This local quality differentiation resolves the contradiction between thermal conductivity and adhesion.
3Temperature
If a thermosetting resin composition is highly filled with an inorganic filler to improve thermal conductivity, then thermal conductivity is improved, but moisture absorption heat resistance characteristics deteriorate
Solution Approach 1:
The invention changes the particle size distribution of the inorganic filler to a bimodal system with first particles of 0.1-5 μm and second particles of 5-50 μm. This parameter optimization reduces the volume of resin matrix required, thereby reducing moisture absorption pathways and improving moisture absorption heat resistance while maintaining high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved thermal conductivity, peel strength, and moisture absorption heat resistance, addressing the limitations of existing resin compositions by optimizing the aspect ratio of hexagonal boron nitride particles and the combination of resin components.
Implementation Method 1
an inorganic filler having excellent thermal conductivity in order to improve thermal conductivity
Implementation Method 2
a resin composition comprising a cyanate compound (A), and a maleimide compound (B) and/or an epoxy resin (C)
Data Source
AI summary
A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.