Resin Composition for High-Frequency Circuit Boards
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Solution Overview
Problem
Current copper-clad laminates used in electronic circuit boards lack sufficient thermal resistance, flame retardancy, and peel strength, particularly at high frequencies, and have high dissipation factors, which do not meet the demands of modern electronic products.
Innovation Solution
A resin composition comprising 40-80 parts by weight of maleimide monomer and/or resin, 10-30 parts by weight of oxydianiline type benzoxazine monomer and/or resin, and 10-40 parts by weight of flame retardants with a thermal decomposition temperature greater than 380°C, including metal phosphinate and bis(pentabromophenyl) ethane, along with optional cyanate ester monomer and epoxy resin, to enhance thermal resistance, flame retardancy, and peel strength while reducing the dissipation factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If epoxy resin and dicyandiamide or phenol novolac resin are used as the major resin and curing agent, then the laminate can be manufactured with conventional processes, but the thermal resistance and dielectric properties fail to satisfy high-frequency electronic product requirements
Solution Approach 1:
The patent changes the chemical composition parameters by introducing bismaleimide resin as the major resin component (50-90 wt%) and using oxydianiline type benzoxazine as curing agent, replacing the conventional epoxy resin system. This parameter change achieves superior thermal resistance (Tg > 200°C) and low dissipation factor (Df < 0.006 at 10 GHz) while maintaining flame retardancy and peel strength
Solution Approach 2:
The patent creates a composite resin system combining bismaleimide resin with oxydianiline type benzoxazine curing agent and specific flame retardants (metal phosphinates, nitrogen-containing compounds). This composite material approach achieves synergistic effects that simultaneously improve thermal resistance, flame retardancy, and dielectric properties beyond what single materials can provide
2Reliability
If bismaleimide resin-based copper-clad laminates are developed to satisfy high thermal resistance requirements, then thermal resistance improves, but dissipation factor increases and peel strength deteriorates
Solution Approach 1:
The patent optimizes the chemical structure parameters of the curing agent by selecting oxydianiline type benzoxazine with specific molecular structure (containing aromatic rings and heterocyclic structures). This structural parameter change reduces dielectric loss while maintaining crosslinking density, achieving low dissipation factor (Df < 0.006 at 10 GHz) alongside high thermal resistance (Tg > 200°C)
3Object-affected harmful factors
If flame retardants are added to epoxy resin systems, then flame retardancy is achieved, but thermal resistance and peel strength are compromised
Solution Approach 1:
The patent applies local quality by selecting flame retardants with specific properties (metal phosphinates with P-O-Metal bonds, nitrogen-containing compounds) that provide flame retardancy through localized chemical mechanisms (formation of protective char layers, release of non-flammable gases) without disrupting the overall polymer matrix structure. This localized approach maintains high thermal resistance (Tg > 200°C) and peel strength while achieving UL94 V-0 flame rating
4Adaptability or versatility
If layer number and trace density are increased to meet electronic product requirements, then circuit functionality improves, but the laminate requires higher thermal resistance and lower dissipation factor
Solution Approach 1:
The patent changes the fundamental material parameters by developing a resin system with Tg > 200°C and Df < 0.006 at 10 GHz. These parameter changes enable the laminate to support higher layer counts and trace densities by providing sufficient thermal management capability and low signal loss, thus enabling advanced circuit functionalities
Data Source
AI summary
Provided is a resin composition and articles made therefrom, wherein the resin composition comprises 40 to 80 parts by weight of maleimide monomer and/or resin; 10 to 30 parts by weight of oxydianiline type benzoxazine monomer and/or resin; 10 to 40 parts by weight of flame retardant; wherein the flame retardant comprises one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane; and wherein the metal of the metal phosphinate flame retardant is selected from Group 13 elements. By using maleimide monomer and/or resin, oxydianiline type benzoxazine monomer and/or resin and flame retardant comprising one or more of a flame retardant having a thermal decomposition temperature of greater than 380° C., a metal phosphinate flame retardant and bis(pentabromophenyl) ethane, the peel strength and the glass transition temperature of the laminate made from the resin composition are remarkably improved while the dissipation factor of the laminate is also decreased; therefore, the demand for high frequency and high thermal resistance circuit boards is satisfied.