Resin Composition for High-Frequency Circuit Boards
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Solution Overview
Problem
Current circuit boards face challenges with low peel strength and high dielectric loss, which are critical issues for high-performance communication equipment requiring high-frequency signal transmission and processing.
Innovation Solution
A resin composition combining unsaturated polyphenylene ether resin, polyolefin resin, and terpene resin, with specific weight ratios and modifications, is used to enhance film-forming properties, adhesion, and dielectric properties, resulting in higher interlayer peel strength and lower dielectric loss in circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyolefin resin is used to achieve good dielectric properties, then dielectric loss is reduced, but peel strength decreases due to fewer reactive groups and weaker intermolecular forces after curing
Solution Approach 1:
The patent combines polyolefin resin with reactive rubber components and curing agents to create a composite adhesive layer. This composite structure allows the material to simultaneously achieve low dielectric loss from the polyolefin and high peel strength from the reactive crosslinked network formed by the rubber and curing agent.
Solution Approach 2:
The patent modifies the adhesive layer composition by incorporating specific ratios of polyolefin resin, reactive rubber, and curing agents. By changing the chemical composition parameters and curing conditions, the material achieves both low dielectric loss and high peel strength through optimized intermolecular forces and crosslinking density.
2Ease of manufacture
If traditional resin composition is used to achieve adequate adhesion, then manufacturing is simplified, but film-forming properties are insufficient for high-performance circuit boards
Solution Approach 1:
The patent introduces a curing agent as an intermediary substance that facilitates the crosslinking reaction between the polyolefin resin and reactive rubber. This intermediary enables the formation of a robust film structure with excellent film-forming properties while maintaining a relatively simple manufacturing process through conventional curing methods.
3Stability of the object's composition
If high filler content is used to achieve structural stability, then board strength is improved, but dielectric loss increases and peel strength decreases
Solution Approach 1:
The patent extracts the filler component from the adhesive layer formulation, focusing instead on creating a polymer-based adhesive system with polyolefin resin and reactive rubber. This extraction eliminates the dielectric loss and peel strength problems associated with fillers while maintaining structural stability through the crosslinked polymer network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved film-forming, adhesion, and dielectric properties, leading to higher interlayer peel strength and lower dielectric loss, meeting the performance requirements of high-frequency circuit boards.
Implementation Method 1
a resin composition, which comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator
Implementation Method 2
the polyolefin resin is one or a combination of at least two selected from the group consisting of polybutadiene resin, SBS resin and styrene butadiene resin
Implementation Method 3
the terpene resin can react with the unsaturated polyphenylene ether resin and the polyolefin resin. Through coordination of the three, the resulting resin composition has good film-forming properties, adhesion properties and dielectric properties
Data Source
AI summary
The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.