Actinic-Ray-Sensitive Resin Composition for Fine Contact Hole Resolution

The patent changes the chemical composition parameters of the resist film by incorporating specific compounds (compounds (1) and/or (2)) that modify the electron energy trapping characteristics. This allows the resist to maintain high sensitivity even at elevated acceleration voltages, resolving the contradiction between resolution improvement and sensitivity maintenance.

The patent uses a composite resist film system combining conventional resist materials with specific functional compounds (compounds (1) and/or (2)). This composite structure enables simultaneous optimization of both sensitivity and resolution by leveraging the complementary properties of the constituent materials.

The patent modifies the resist film's chemical composition by incorporating compounds (1) and/or (2) that change the electron interaction characteristics with the resist substrate. This parameter change reduces the harmful backward scattering effects, allowing high acceleration voltage operation without resolution deterioration in isolated patterns.

The patent converts the potentially harmful backward scattering effect into a beneficial outcome by using the specific compound structure to control electron reflection. The modified resist composition allows controlled electron interaction that transforms the backward scattering phenomenon into an acceptable or even advantageous effect for pattern formation.

The patent employs a composite resist composition combining conventional resist materials with specific functional compounds (compounds (1) and/or (2)). This composite approach maintains ease of manufacture by using standard processing methods while achieving superior resolution and roughness performance through the synergistic effect of the combined materials.

The patent introduces specific functional groups and compounds (compounds (1) and/or (2)) at localized positions within the resist film structure where they can most effectively influence electron interaction and pattern formation. This local quality enhancement improves resolution and roughness performance without complicating the overall manufacturing process.