Resin Composition for Low-Temperature Curing and Moisture Resistance
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Solution Overview
Problem
Existing one-component adhesives used in manufacturing image sensor modules and electronic components fail to provide sufficient moisture resistance and PCT (pressure cooker test) tolerance when thermally cured at 80°C, due to hydrolysis of ester bonds in thiol-based adhesives under high-temperature, high-humidity conditions.
Innovation Solution
A resin composition comprising an epoxy resin, a compound with four thiol groups represented by formula (1) without ester bonds, a curing accelerator, and a silane coupling agent, with specific ratios and types of components to enhance adhesive strength and PCT tolerance, including the use of imidazole-based or tertiary amine-based curing accelerators and 3-glycidoxypropyltrimethoxysilane as the silane coupling agent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thiol-based adhesive containing epoxy resin, polythiol compound, and curing accelerator is used for thermal curing at 80°C, then low-temperature curing is achieved, but PCT tolerance is insufficient due to hydrolysis of ester bonds
Solution Approach 1:
The patent changes the chemical structure parameter of the polythiol compound by eliminating ester bonds and using only thiol groups (formula (1) with four thiol groups). This structural parameter change prevents hydrolysis under PCT conditions while maintaining low-temperature curing capability through the thiol-epoxy reaction mechanism.
Solution Approach 2:
The patent creates a composite resin composition combining epoxy resin, polythiol compound (formula (1)), curing accelerator, and silane coupling agent. This composite structure provides both low-temperature curing capability and enhanced PCT tolerance, where the silane coupling agent specifically addresses moisture resistance while the polythiol compound ensures thermal curing at 80°C.
2Temperature
If ester bonds are present in the thiol-based adhesive, then the adhesive can be cured at 80°C, but the adhesive strength deteriorates under high-temperature, high-humidity conditions
Solution Approach 1:
The patent extracts and removes the ester bond component from the polythiol compound structure. By using only thiol groups (formula (1)) without ester bonds, the adhesive eliminates the hydrolyzable linkage that causes strength deterioration under PCT conditions, while the thiol-epoxy reaction maintains 80°C curing capability.
Solution Approach 2:
The patent converts the potential harm of needing ester bonds for curing flexibility into a benefit by using thiol groups that provide both curing capability and inherent resistance to hydrolysis. The thiol groups enable 80°C curing while simultaneously preventing the hydrolysis that would occur with ester bonds under PCT conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves thermal curing at 80°C with improved PCT tolerance, maintaining adhesive strength and preventing hydrolysis, making it suitable for manufacturing image sensor modules and electronic components with enhanced reliability.
Implementation Method 1
a silane coupling agent; with specific ratios and types of components to enhance adhesive strength and PCT tolerance
Implementation Method 2
thermal curing at a relatively low temperature, specifically thermal curing at approximately 80° C.
Implementation Method 3
a curing accelerator; An equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) component is 1:0.002 to 1:1
Implementation Method 4
a compound represented by formula (1) below; A content of the compound of the (B) component is 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component
Data Source
AI summary
A resin composition containing (A) an epoxy resin; (B) a compound represented by formula (1) below; (C) a curing accelerator; and (D) a silane coupling agent is provided. The compound of the (B) component has a content of 1:0.5 to 1:2.5, in terms of an equivalent ratio between epoxy groups in the epoxy resin of the (A) component and thiol groups in the compound of the (B) component, the silane coupling agent of the (D) component has a content of 0.2 parts by mass to 50 parts by mass with respect to 100 parts by mass in total of the (A) component, the (B) component, the (C) component, and the (D) component, and an equivalent ratio between thiol groups in the compound of the (B) component and Si in the silane coupling agent of the (D) is 1:0.002 to 1:1.