Resin Composition for Low-Temperature Curing and Outgas Suppression
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Solution Overview
Problem
Current heat-resistant resin compositions used in semiconductor applications face challenges in achieving high sensitivity and chemical resistance at low baking temperatures of 250°C or less, while also minimizing outgas generation during curing.
Innovation Solution
A resin composition incorporating an alkali-soluble resin with polyimide, polybenzoxazole, or polyamide-imide, along with a phenolic hydroxyl group-modified resin having a specific structural unit, which allows for efficient curing and high chemical resistance without significant outgas production at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat resistant resin compositions are cured at low temperature (250°C or less), then sensitivity and chemical resistance are improved, but outgas generation increases due to unreacted crosslinkable groups
Solution Approach 1:
The patent changes the chemical structure parameters of the crosslinking agent from conventional types (epoxy, polyisocyanate, polyamide) to a specific compound with formula (1) containing a triazine ring and aromatic hydrocarbon groups. This structural parameter change enables the crosslinking reaction to proceed efficiently at low temperatures with complete reaction, eliminating unreacted groups that would otherwise generate outgas. The specific molecular structure of the crosslinking agent provides both low-temperature reactivity and complete conversion, resolving the contradiction between low-temperature curing and outgas suppression.
Solution Approach 2:
The patent creates a composite resin composition system combining heat resistant resin (polyimide, polyamide-imide, or polybenzoxazole) with a specific crosslinking agent having formula (1). This composite material system achieves synergistic effects where the heat resistant resin provides thermal stability and the specially designed crosslinking agent provides low-temperature curing capability with complete reaction. The composite nature of the system allows simultaneous achievement of low-temperature processing, high chemical resistance, and minimal outgas generation.
2Reliability
If conventional crosslinking agents (epoxy, polyisocyanate, polyamide) are used, then chemical resistance is improved, but outgas generation increases due to unreacted crosslinkable groups after low-temperature curing
Solution Approach 1:
The patent fundamentally changes the chemical parameters of the crosslinking agent by introducing a specific molecular structure with formula (1) containing a triazine ring core with aromatic hydrocarbon substituents. This parameter change in molecular structure provides unique properties: the triazine ring enables low-temperature reactivity while the aromatic groups provide chemical resistance. The specific structural parameters (R1-R6 being aromatic hydrocarbon groups, s+t≥1, u=1 or 2) are optimized to achieve complete reaction at low temperatures, eliminating unreacted groups that would generate outgas while maintaining chemical resistance.
3Productivity
If photosensitive resin compositions containing phenolic resins are baked at low temperature (250°C or less), then sensitivity is improved, but outgas increases due to unreacted crosslinkable groups
Solution Approach 1:
The patent changes the crosslinking mechanism parameters by replacing conventional thermal crosslinking agents with a photoactive crosslinking agent having formula (1) that contains triazine ring structures capable of photo-induced crosslinking. This parameter change in the crosslinking mechanism enables the system to achieve complete crosslinking reaction upon light exposure at low temperatures, eliminating unreacted crosslinkable groups. The photoactive nature of the crosslinking agent provides high sensitivity to light exposure while ensuring complete reaction to prevent outgas generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high sensitivity and chemical resistance even at low baking temperatures, with reduced outgas generation, making it suitable for applications like semiconductor devices and organic EL displays.
Implementation Method 1
a resin composition which contains an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and an alkali-soluble resin having a benzoxazine ring structure
Data Source
AI summary
The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%.(In general formula (1), O represents an oxygen atom. R1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)