Resin Composition for High Depth of Focus and Pattern Collapse Resistance
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Solution Overview
Problem
Current resist compositions used in microfabrication, such as those described in JP2010-197619A, do not adequately meet the demands for high depth of focus (DOF) and pattern collapse resistance, especially when forming fine patterns.
Innovation Solution
A radiation-sensitive resin composition incorporating a specific acid-decomposable repeating unit, represented by General Formula (1) and (2), with a monocyclic alicyclic structure and specific alkyl groups, is used to form a film that is sensitive to actinic rays or radiation, followed by development with an organic solvent-based developer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist composition is used, then basic pattern formation is achieved, but depth of focus is insufficient and pattern collapse occurs in fine patterns
Solution Approach 1:
The patent modifies the chemical structure of the resin by introducing specific repeating units with acid-labile groups (General Formula 1) and controlling the ratio of specific repeating units (General Formula 2) to achieve optimal depth of focus and pattern collapse resistance. This involves changing molecular weight, functional group composition, and chemical structure parameters of the resist resin.
Solution Approach 2:
The patent uses a composite resin system comprising multiple types of repeating units (General Formula 1, 2, and other units) with different functions. The resin combines acid-labile groups for sensitivity, alicyclic structures for mechanical properties, and specific alkyl groups for solubility control, creating a multi-functional composite material that simultaneously achieves high depth of focus and pattern collapse resistance.
2Manufacturing precision
If fine patterns are formed, then higher manufacturing precision is achieved, but pattern collapse resistance deteriorates
Solution Approach 1:
The patent introduces repeating units with specific local structural features (General Formula 2) that have 5 or 6 carbon atoms in the alicyclic structure, creating localized regions with enhanced mechanical strength and solubility characteristics. This local structural optimization prevents pattern collapse at critical dimensions while maintaining overall pattern fineness.
Solution Approach 2:
The patent optimizes the molecular weight and composition parameters of the resin to achieve a balance between pattern resolution and mechanical stability. By controlling the ratio of repeating units and the molecular weight distribution, the resist maintains sufficient film strength for fine patterns while achieving the required pattern collapse resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a high depth of focus and suppresses pattern collapse during the formation of fine patterns, enhancing the manufacturing capabilities for electronic devices.
Implementation Method 1
a resin (P) including a repeating unit (i) having a group which decomposes by the action of an acid, represented by General Formula (1)
Data Source
AI summary
The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a resin (P) including a repeating unit (i) having a group which decomposes by the action of an acid represented by the following General Formula (1), a pattern forming method using the composition, a method for manufacturing an electronic device, and an electronic device.