Radiation-Sensitive Resin Composition for Organic Solvent Developer
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Solution Overview
Problem
Conventional radiation-sensitive resin compositions used in resist pattern-forming methods with organic solvent developers face challenges in achieving both superior etching resistance and inhibiting film loss, which affects lithography characteristics such as CDU, MEEF, and resolution.
Innovation Solution
A resist pattern-forming method using a radiation-sensitive resin composition with a polymer component containing a hydrocarbon group and an acid-labile group, where the hydrocarbon group includes an unsubstituted or substituted branched chain or monocyclic alicyclic group and an adamantane skeleton, with a molar ratio of the adamantane group to the first hydrocarbon group less than 1, and a proportion of hydroxyl groups less than 5 mol%, developed using a developer solution with at least 80% organic solvent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an organic solvent is used as a developer solution, then high optical contrast and fine pattern formation are achieved, but film loss occurs at light-exposed sites and etching resistance deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by incorporating specific hydrocarbon groups (adamantane skeleton, branched chain groups with 3-8 carbon atoms) and controlling the proportion of hydroxyl groups (less than 5 mol%). These parameter changes modify the dissolution behavior of the resist film in organic solvent developers, reducing film loss while maintaining pattern formation quality.
Solution Approach 2:
The patent uses a composite resin composition containing multiple structural units: a first structural unit with hydrocarbon groups (adamantane skeleton), a second structural unit with branched chain groups (3-8 carbon atoms), and a third structural unit with acid-labile groups. This composite structure combines the benefits of different functional groups to achieve both film stability and developability.
2Manufacturing precision
If an organic solvent is used as a developer solution, then high optical contrast is achieved, but etching resistance deteriorates due to decreased carbon content
Solution Approach 1:
The patent changes the carbon content parameter by incorporating structural units with adamantane skeletons (high carbon content) and branched chain groups. The specific ratio of these hydrocarbon groups ensures sufficient carbon content is maintained in the resist film, preserving etching resistance while allowing high optical contrast during development.
Solution Approach 2:
The composite resin composition combines hydrocarbon-rich structural units (adamantane, branched chains) with acid-labile groups. This composite structure maintains high carbon content for etching resistance while the acid-labile groups provide the necessary chemical change for high-contrast patterning during development.
3Manufacturing precision
If the film loss is reduced, then lithography characteristics (CDU, MEEF, resolution) are improved, but this requires specific resin composition adjustments
Solution Approach 1:
The patent defines specific parameter ranges for the resin composition: hydroxyl group proportion less than 5 mol%, adamantane skeleton units with specific carbon atom counts (3-8), and controlled ratios of different structural units. These parameter specifications provide a clear formulation guide that achieves improved lithography characteristics without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves both superior etching resistance and inhibition of film loss, resulting in improved lithography characteristics like CDU and resolution, by balancing the dissolution of the polymer component at exposed sites and maintaining high carbon content.
Implementation Method 1
a radiation-sensitive resin composition has been known which generates an acid at light-exposed sites by irradiation with a radioactive ray (i.e., exposure)
Implementation Method 2
a catalytic action of the acid allows the difference in dissolution rates in developing solutions to be produced between the light-exposed site and the light-unexposed site
Data Source
AI summary
A resist pattern-forming method includes forming a resist coating film using a radiation-sensitive resin composition. The resist coating film is exposed and developed using a developer solution containing no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer component including a polymer having an acid-labile group, and a radiation-sensitive acid generator. The polymer component includes, in an identical polymer or different polymers, a first structural unit having a first hydrocarbon group, and a second structural unit having a second hydrocarbon group. The first hydrocarbon group is an unsubstituted or substituted branched chain group, or the like. The second hydrocarbon group has an adamantane skeleton. A molar ratio of the second hydrocarbon group to the first hydrocarbon group is less than 1. A proportion of a structural unit having a hydroxyl group in the polymer component is less than 5 mol %.