Resin Composition for Low Dielectric Loss Laminates
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Solution Overview
Problem
Conventional printed circuit board laminates using epoxy resins have high dielectric loss and dielectric constant values that do not meet the requirements for high-frequency applications, necessitating the development of a resin composition with improved electrical properties such as high peeling strength, high dielectric constant, and low dielectric loss.
Innovation Solution
A resin composition comprising a thermosetting resin component with a dissipation factor of no more than 0.006 at 1 GHz, combined with a ceramic powder filler obtained through a sintering process at temperatures between 1300° C. and 1400° C., which is used to create a prepreg and subsequently a laminate with enhanced electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used as the base resin, then the laminate achieves good mechanical strength and adhesion, but the dielectric loss is high and dielectric constant is insufficient for high-frequency applications
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (PPE) resin with epoxy resin and cyanate ester resin. The PPE resin component provides low dielectric loss properties while the epoxy resin maintains mechanical strength and adhesion. This composite approach allows simultaneous achievement of low dielectric loss (Df ≤ 0.006) and good mechanical properties.
2Reliability
If ceramic powder filler is added to increase dielectric constant, then the laminate achieves high Dk value, but the dielectric loss increases and processing becomes more difficult
Solution Approach 1:
The patent carefully controls the particle size of ceramic powder filler within 0.1-2.0 μm and limits the filler content to 10-600 parts by weight per 100 parts of resin. The ceramic powder has specific surface area of 0.1-10.0 m²/g and undergoes sintering at 1300-1400°C. These parameter optimizations ensure high dielectric constant while minimizing dielectric loss and maintaining processability.
3Reliability
If ceramic powder filler is added to improve dielectric properties, then the laminate achieves high Dk and low Df, but the peeling strength becomes insufficient
Solution Approach 1:
The composite resin system of PPE, epoxy resin, and cyanate ester resin provides balanced properties. The epoxy and cyanate ester components contribute to strong adhesion and peeling strength while PPE maintains low dielectric loss. The synergistic effect of these resins together with optimized ceramic filler ensures both excellent dielectric properties and sufficient peeling strength (>5 lb/inch).
Solution Approach 2:
The patent optimizes the particle size of ceramic powder (0.1-2.0 μm) and its content ratio to balance dielectric performance and mechanical strength. The controlled particle size prevents excessive filler aggregation that would weaken the laminate, while sufficient filler content maintains high dielectric constant and low loss.
4Reliability
If ceramic powder is sintered at high temperature to improve dielectric properties, then the laminate achieves low Df and high Dk, but the manufacturing complexity and energy consumption increase
Solution Approach 1:
The patent specifies sintering temperature range of 1300-1400°C and particle size range of 0.1-2.0 μm to achieve optimal dielectric properties. These parameter ranges are carefully selected to balance the sintering process complexity with the achieved dielectric performance, ensuring low Df and high Dk while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a laminate with high peeling strength, high dielectric constant, and low dielectric loss, suitable for high-frequency applications, while maintaining satisfactory physicochemical properties and appearance.
Implementation Method 1
the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C.
Implementation Method 2
the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz
Data Source
AI summary
A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.