Thermosetting Resin Composition for Low Dielectric Loss
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Solution Overview
Problem
There is a growing demand for materials with low dielectric tangent for higher frequency domains in resin compositions, particularly to address transmission loss in high-frequency applications such as mobile phones and satellite broadcasting, where existing materials do not adequately suppress transmission loss at GHz frequencies.
Innovation Solution
A thermosetting resin composition is developed, comprising a polyimide compound with maleimide groups, a modified polybutadiene, and an inorganic filler, specifically designed to reduce dielectric tangent and improve handling properties, while minimizing resin separation and gloss unevenness in interlayer insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a cyanate resin is used to reduce dielectric tangent, then transmission loss is suppressed, but handling properties deteriorate and resin separation occurs
Solution Approach 1:
The patent changes the chemical composition parameters by introducing a polyimide compound with specific structural units (formula 1 and formula 2) and controlling their ratios, along with using modified polybutadiene with specific molecular weight ranges, to achieve optimal dielectric properties while maintaining handling characteristics
Solution Approach 2:
The patent creates a composite resin composition combining multiple components: polyimide compound with specific structural units, modified polybutadiene, and inorganic filler, where each component contributes specific properties to achieve overall low dielectric tangent while preventing resin separation
2Temperature
If filler is highly filled to reduce thermal expansion, then thermal expansion is reduced, but processing dimensional stability and warpage control are affected
Solution Approach 1:
The patent optimizes the particle size distribution of inorganic filler (combining fine particles of 0.1-1 μm and coarse particles of 1-10 μm) and controls the filler content ratio to achieve both low thermal expansion and good processing dimensional stability
Solution Approach 2:
The patent uses a dual-size filler system where fine particles fill gaps between coarse particles, creating a dense packing structure that reduces thermal expansion while maintaining dimensional stability during processing
3Loss of energy
If resin composition is optimized for low dielectric tangent, then transmission loss is suppressed, but resin separation and gloss unevenness increase
Solution Approach 1:
The patent uses modified polybutadiene as an intermediary component that improves compatibility between the polyimide compound and inorganic filler, preventing resin separation and gloss unevenness while maintaining low dielectric tangent properties
Solution Approach 2:
The patent controls the molecular weight of modified polybutadiene (500-25,000) and the ratio of structural units in the polyimide compound to optimize resin homogeneity and prevent separation issues
Data Source
AI summary
Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).