Resin Composition for Low Dielectric PCBs
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Solution Overview
Problem
Current resin compositions for printed wiring boards face challenges in simultaneously achieving low dielectric constant, low dielectric loss tangent, and low thermal expansivity properties, which are essential for high integration and miniaturization in electronic devices.
Innovation Solution
A resin composition combining a maleimide compound, a cyanate ester compound, a specific polyphenylene ether compound with a number average molecular weight between 1000 and 7000, and a block copolymer with a styrene backbone, along with optional fillers and flame retardants, to form a uniform cured product with improved electrical and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin composition contains a bifunctional vinyl benzyl compound with specific polyphenylene ether backbone, a specific maleimide compound, a specific cyanate ester resin, and a specific epoxy resin, then copper foil peel strength and moisture absorption heat resistance are improved, but dielectric constant and dielectric loss tangent properties are not simultaneously optimized
Solution Approach 1:
The patent changes the molecular weight parameter of the polyphenylene ether compound to a specific range (1000-7000) and adjusts the proportions of multiple resin components to achieve optimal balance between copper foil peel strength and dielectric properties
Solution Approach 2:
The patent uses a composite resin system combining five different resin components (polyphenylene ether, maleimide, cyanate ester, epoxy resin, and vinyl compound) in specific proportions to simultaneously achieve multiple performance requirements including low dielectric constant, low dielectric loss tangent, and high copper foil peel strength
2Stability of the object's composition
If a resin composition uses a styrene-based thermoplastic elastomer, then low thermal expansivity is achieved, but dielectric loss tangent properties are not sufficiently improved
Solution Approach 1:
The patent combines styrene-based thermoplastic elastomer with other four resin components in a five-component system, where each component contributes specific properties that collectively achieve both low thermal expansivity and low dielectric loss tangent
Solution Approach 2:
The patent optimizes the proportion of styrene-based thermoplastic elastomer within the resin composition to achieve the desired balance between thermal stability and dielectric properties
3Reliability
If a resin composition uses polybutadiene modified with hydroxy group or acrylic group, then low dielectric loss tangent properties are improved, but thermal expansivity control is compromised
Solution Approach 1:
The patent changes the chemical structure parameter by using styrene-based thermoplastic elastomer instead of polybutadiene modified with hydroxy or acrylic groups, which allows simultaneous control of thermal expansivity and dielectric loss tangent properties
Data Source
AI summary
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.