Resin Composition for Low Dielectric and High Tg
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Solution Overview
Problem
Current resin compositions used in electronic devices, such as prepregs and metal-clad laminates, face limitations in achieving high heat resistance, high glass transition temperature (Tg), low coefficient of thermal expansion, and excellent adhesion while maintaining low dielectric properties and handleability.
Innovation Solution
A resin composition containing a thermosetting compound with a styrene or (meth)acrylate structure and a maleimide compound, specifically a polyphenylene ether compound modified with styrene or (meth)acrylate structures, in a specific mass ratio, which enhances interface adhesion and reactivity, leading to improved heat resistance, adhesion, and moldability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin composition containing maleimide compound is used to achieve low dielectric properties, then the dielectric constant and dielectric loss tangent are reduced, but the glass transition temperature (Tg) and heat resistance are insufficient
Solution Approach 1:
The patent uses a composite resin system combining maleimide compound (for low dielectric properties) with phenolic resin and cycloaliphatic polyamine (for high Tg and heat resistance). This composite approach allows the cured product to simultaneously achieve low dielectric constant (3.8 or less) and high glass transition temperature (150°C or more), resolving the contradiction between dielectric performance and thermal stability.
Solution Approach 2:
The patent optimizes the compositional parameters by controlling the weight ratios of maleimide compound (60-90 parts), phenolic resin (10-40 parts), and cycloaliphatic polyamine (5-20 parts). By adjusting these parameters within specific ranges, the cured product achieves both low dielectric properties and high Tg, demonstrating parameter optimization to resolve the contradiction.
2Temperature
If the resin composition is optimized for high Tg and heat resistance, then the thermal properties are improved, but the adhesion and handleability of prepreg deteriorate
Solution Approach 1:
The patent controls the compositional parameters within specific ranges: maleimide compound (60-90 parts), phenolic resin (10-40 parts), and cycloaliphatic polyamine (5-20 parts). This parameter optimization ensures that the prepreg maintains good handleability and adhesion while the cured product achieves high heat resistance and Tg of 150°C or more.
Solution Approach 2:
The phenolic resin acts as an intermediary component that bridges the maleimide compound and cycloaliphatic polyamine, facilitating both good handleability in the prepreg state and high heat resistance in the cured state. The phenolic resin content (10-40 parts) is optimized to balance these competing requirements.
3Reliability
If the resin composition achieves high adhesion and heat resistance, then the thermal stability is improved, but the coefficient of thermal expansion increases
Solution Approach 1:
The patent employs a composite system where cycloaliphatic polyamine (5-20 parts) reacts with phenolic resin to form a crosslinked network that provides both high adhesion and low coefficient of thermal expansion (50 ppm/°C or less). The maleimide compound (60-90 parts) contributes to dimensional stability, and the synergistic interaction among components achieves simultaneous optimization of adhesion and thermal expansion properties.
4Reliability
If the resin composition is designed for low dielectric properties, then the signal transmission performance is improved, but the moldability and handleability of semi-cured products deteriorate
Solution Approach 1:
The patent uses preliminary action by controlling the reaction between maleimide compound and cycloaliphatic polyamine to form a semi-cured state with appropriate viscosity and handleability before final curing. The phenolic resin (10-40 parts) acts as a viscosity modifier that maintains moldability during processing while the maleimide compound (60-90 parts) ensures low dielectric properties in the final cured product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high heat resistance, high Tg, low coefficient of thermal expansion, and excellent adhesion, along with low dielectric properties and improved handleability, making it suitable for advanced electronic components like prepregs, films, and metal-clad laminates.
Implementation Method 1
containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound... a content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio
Implementation Method 2
thermosetting compound having a styrene structure or a (meth)acrylate structure... enhances interface adhesion and reactivity, leading to improved heat resistance, adhesion, and moldability
Data Source
AI summary
One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1):wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.