Resin Composition for Low Dielectric Wiring Boards
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Solution Overview
Problem
Current substrate materials for electronic devices face challenges in achieving low dielectric characteristics, high glass transition temperature, heat resistance, adhesiveness, low water absorption, and moldability, especially with the miniaturization and humid environment requirements of modern electronic components.
Innovation Solution
A resin composition incorporating a modified polyphenylene ether compound with carbon-carbon unsaturated double bonds, a maleimide compound with multiple N-substituted groups, and a liquid styrene-butadiene copolymer with a weight average molecular weight less than 10000, which enhances moldability, handleability, and dielectric properties while maintaining high thermal stability and low water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a styrene-based thermoplastic elastomer with large molecular weight is added to improve dielectric characteristics, then dielectric characteristics are improved, but resin fluidity deteriorates and moldability is impaired
Solution Approach 1:
The patent changes the molecular weight parameter of the styrene-based thermoplastic elastomer from large molecular weight to specifically 10,000-1,000,000, and controls the maleimide compound content at 1-50 parts by mass per 100 parts by mass of vinyl compound. These parameter adjustments resolve the contradiction by achieving both improved dielectric characteristics and maintained moldability.
Solution Approach 2:
The patent creates a composite resin composition system combining vinyl compound, maleimide compound, and styrene-based thermoplastic elastomer in specific proportions. This composite approach allows the materials to complement each other, where the elastomer provides dielectric benefits while the controlled ratios prevent excessive viscosity increase, thus resolving the moldability issue.
2Reliability
If resin composition is optimized for low dielectric constant and low dielectric loss tangent, then dielectric characteristics are improved, but glass transition temperature and heat resistance may be compromised
Solution Approach 1:
The patent specifies the molecular weight range of the styrene-based thermoplastic elastomer at 10,000-1,000,000 and the maleimide compound content at 1-50 parts by mass per 100 parts by mass of vinyl compound. These controlled parameters enable the resin composition to achieve both low dielectric characteristics and high glass transition temperature, as verified in the examples where Tg reached 140-160°C while maintaining low dielectric loss.
3Reliability
If water absorption of cured product is reduced to improve performance in humid environments, then reliability in humid conditions is improved, but moldability during processing may be affected
Solution Approach 1:
The patent controls the molecular weight of the styrene-based thermoplastic elastomer within 10,000-1,000,000 and the maleimide compound content at 1-50 parts by mass per 100 parts by mass of vinyl compound. This optimization achieves water absorption of 0.01-0.5% in the cured product while maintaining excellent moldability during processing, as demonstrated in the experimental examples.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides excellent moldability, handleability, low dielectric characteristics, high glass transition temperature, and low water absorption, ensuring reliable performance in electronic devices across a wide temperature range and humid environments.
Implementation Method 1
a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end
Implementation Method 2
a maleimide compound having two or more N-substituted maleimide groups in one molecule
Data Source
AI summary
One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.