Resin Composition for Display Substrate Pinhole Reduction
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Solution Overview
Problem
Heat resistant resin films used in display substrates suffer from poor barrier properties, leading to moisture and oxygen infiltration, which can deactivate organic EL displays and result in pixel defects and low production yields due to pinhole formation during the coating process.
Innovation Solution
A resin composition is developed using a solvent with an amide compound having a surface tension of 35 mN/m or less, combined with a silane compound to reduce pinhole generation and prevent film lifting during calcination, ensuring a high yield in organic EL display substrate production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat resistant resin film is used as display substrate, then heat resistance and electrical insulation properties are improved, but barrier properties deteriorate leading to moisture and oxygen infiltration
Solution Approach 1:
The invention uses a composite solvent system combining an amide compound (surface tension ≤35 mN/m) with another solvent to create a resin composition that forms a film with both heat resistance and improved barrier properties. The specific solvent combination and surface tension control create a composite structure at the molecular level that addresses both requirements simultaneously.
Solution Approach 2:
The invention changes the surface tension parameter of the solvent to 35 mN/m or less by selecting specific amide compounds, which fundamentally alters the coating behavior and film formation process. This parameter change leads to reduced pinhole formation and improved barrier properties while maintaining heat resistance.
2Ease of manufacture
If conventional solvent is used for resin composition, then resin dissolution is achieved, but pinhole formation occurs during coating and drying
Solution Approach 1:
The invention changes the surface tension parameter of the solvent to 35 mN/m or less, which fundamentally alters the wetting and drying behavior of the coating. This parameter change allows the coating to maintain uniformity during drying without forming pinholes, while still achieving complete resin dissolution.
Solution Approach 2:
The amide compound with specific surface tension acts as an intermediary substance that mediates between the resin and the coating process. It enables proper resin dissolution while controlling the evaporation and drying behavior to prevent pinhole formation.
3Productivity
If inorganic film is coated with conventional resin composition, then display substrate is formed, but significant pinhole generation occurs
Solution Approach 1:
The invention changes the surface tension of the resin composition by selecting specific solvent systems, which improves the wetting properties on inorganic films. This parameter change prevents pinhole generation during coating while maintaining efficient substrate formation and production throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition significantly reduces pinhole formation and enhances the barrier properties of the display substrate, leading to improved reliability and yield in organic EL display production by preventing moisture and oxygen infiltration.
Implementation Method 1
the solvent containing, as primary component, an amide compound with a surface tension of 35 mN/m or less at 25° C.
Data Source
AI summary
A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.