Resin Composition for Organic EL Sealing with Low Moisture Permeability
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Solution Overview
Problem
Existing resin compositions for sealing organic EL devices face issues such as moisture degradation, delamination, and metal corrosion due to high moisture permeability and insufficient adhesive strength, with limited solutions for determining optimal moisture content and component composition.
Innovation Solution
A resin composition comprising an alicyclic epoxy compound, bisphenol A and F epoxy resins, and a photocationic polymerization initiator, with a moisture content of 1000 ppm or less, and optionally including a filler, stabilizer, silane coupling agent, and photosensitizer, to enhance adhesiveness and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If resin composition is used for sealing organic EL device, then adhesion strength is improved, but moisture permeability increases causing device degradation
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by selecting specific epoxy compounds (aliphatic, aromatic, alicyclic types) and controlling their molecular weights and structures. This parameter optimization allows achieving both high adhesion strength and low moisture permeability simultaneously, resolving the contradiction between these two properties.
Solution Approach 2:
The patent creates a composite resin system by combining multiple epoxy compounds with different characteristics (aliphatic for flexibility, aromatic for strength, alicyclic for moisture resistance) along with specific photopolymerization initiators. This composite approach enables the resin to exhibit both strong adhesion and low moisture permeability, overcoming the limitation of single-component resins.
2Stability of the object's composition
If moisture content in resin composition is reduced, then storage stability is improved, but adhesiveness deteriorates
Solution Approach 1:
The patent optimizes the moisture content parameter within a specific range (50-1000 ppm) rather than minimizing it completely. This controlled parameter change maintains storage stability while preserving the adhesiveness required for effective sealing, resolving the contradiction between these two properties.
3Ease of manufacture
If conventional sealing methods are used, then manufacturing simplicity is maintained, but delamination occurs due to insufficient adhesion
Solution Approach 1:
The patent replaces conventional thermal curing methods with photopolymerization curing using UV or visible light. This substitution maintains manufacturing simplicity while achieving superior adhesion strength, as the photopolymerization process provides better bonding without requiring complex thermal processing equipment or procedures.
4Strength
If resin composition with higher moisture content is used, then adhesiveness is improved, but metal corrosion occurs on organic EL device
Solution Approach 1:
The patent precisely controls the moisture content parameter within the optimal range of 50-1000 ppm. This parameter control ensures sufficient adhesiveness for strong bonding while preventing the excessive moisture that would cause metal corrosion, thereby resolving the contradiction between these two harmful effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively inhibits degradation of organic EL devices by ensuring low moisture permeability and strong adhesion, even with higher moisture content, and maintains storage stability and adhesion durability.
Implementation Method 1
a photocationic polymerization initiator
Data Source
AI summary
A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more.