Thermoplastic Resin Composition for Abrasion-Resistant ESD Moldings
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Solution Overview
Problem
Existing polyaryletherketone (PAEK) and polyarylethersulfone (PAES) resin blends suffer from limited compatibility, leading to variations in properties like rigidity and impact strength depending on processing direction, and lack adequate abrasion resistance and electrostatic dissipative performance for semiconductor processing applications.
Innovation Solution
A thermoplastic resin composition comprising 60-90 wt% PAEK, 10-40 wt% PAES, 1-4 parts by weight of carbon nanotubes, and 2-7 parts by weight of graphite, with domain sizes of polyarylethersulfone in the PAEK matrix less than 0.5 μm, ensuring a balanced combination of abrasion resistance, electrostatic charge dissipation, and impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyaryletherketone and polyarylethersulfone resins are blended to enhance impact strength, then impact resistance is improved, but compatibility deteriorates leading to variation in properties depending on processing direction
Solution Approach 1:
The patent applies parameter changes by precisely controlling the domain size of PAES to 0.5 μm or less and optimizing the weight ratio of PAEK to PAES (60:40 to 90:10). This parameter control ensures uniform distribution of PAES domains within the PAEK matrix, achieving improved impact resistance while maintaining compositional stability and eliminating anisotropic property variations.
2Strength
If polyaryletherketone and polyarylethersulfone resins are blended, then impact strength is enhanced, but rigidity deteriorates
Solution Approach 1:
The patent resolves this contradiction through parameter changes by controlling the PAES domain size to 0.5 μm or less and optimizing the blend ratio. The fine domain dispersion allows the matrix to maintain its rigidity while the interfacial area provides sufficient impact energy absorption, achieving both high rigidity and enhanced impact strength simultaneously.
3Ease of manufacture
If conventional resin blends are used, then manufacturing is simplified, but abrasion resistance and electrostatic dissipative performance are insufficient
Solution Approach 1:
The patent applies composite materials principle by creating a multi-phase system consisting of PAEK matrix, PAES domains (0.5 μm or less), and conductive filler particles. This composite structure provides abrasion resistance through the hard PAES domains, ESD performance through conductive fillers, while maintaining manufacturing simplicity through a single-step blending and molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves uniform properties in both machine and transverse directions, with improved abrasion resistance, electrostatic charge dissipation, and impact resistance, suitable for semiconductor processing equipment.
Implementation Method 1
about 1 part by weight to about 4 parts by weight of carbon nanotubes; and about 2 parts by weight to about 7 parts by weight of graphite
Implementation Method 2
domains (the polyarylethersulfone resin) in a matrix (the polyaryletherketone resin) have an average size of about 0.5 μm or less
Data Source
AI summary
A thermoplastic resin composition of the present invention comprises: approximately 100 weight parts thermoplastic resin comprising approximately 60-90 wt % polyaryletherketone resin and approximately 10-40 wt % polyarylethersulfone resin; approximately 1-4 weight parts carbon nanotubes; and approximately 2-7 weight parts graphite, wherein the average size of domains (polyarylether sulfone resin) in a matrix (polyaryletherketone resin) measured at 10,000 and 50,000 times magnification using a scanning electron microscope (SEM) is approximately 0.5 μm or less. The thermoplastic resin composition is strong, has good abrasion resistance, impact resistance, and dissipation of electrostatic discharge, and has excellent balance of said physical properties.