Resin Composition for EUV Lithography Pattern Formation
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Solution Overview
Problem
Current techniques for electron beam, X-ray, and EUV lithography fail to simultaneously achieve high sensitivity, high resolution, good pattern form, and reduced line edge roughness, while also minimizing outgassing, which is crucial for fine pattern formation in semiconductor manufacturing.
Innovation Solution
An actinic ray-sensitive or radiation-sensitive resin composition comprising specific repeating units capable of decomposing to form acids and carboxylic acids, combined with a solvent having a boiling temperature of 150°C or less, and a carbon-carbon unsaturated bond, optimized to improve sensitivity, resolution, and line edge roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If higher sensitization is pursued in positive resist for electron beams, then sensitivity is improved, but resolution deteriorates and line edge roughness worsens
Solution Approach 1:
The patent uses a composite resin system comprising multiple specific resin components (including polyhydroxystyrene derivatives and other copolymers) with defined compositional ratios. This composite approach allows the resist to achieve high sensitivity through synergistic interactions while maintaining resolution and line edge roughness by balancing the functional properties of each resin component.
Solution Approach 2:
The patent optimizes specific parameters including the compositional ratios of different resin components (e.g., polyhydroxystyrene content at 20-80 mass%), molecular weight ranges (1,000-100,000), and the presence of specific functional groups. These parameter adjustments enable simultaneous improvement of sensitivity, resolution, and line edge roughness by fine-tuning the resist's chemical and physical properties.
2Reliability
If higher sensitization is pursued in positive resist for electron beams, then sensitivity is improved, but line edge roughness deteriorates
Solution Approach 1:
The patent employs a composite resin system with specific components that work synergistically to reduce line edge roughness while maintaining high sensitivity. The combination of polyhydroxystyrene derivatives with other copolymers creates a uniform matrix that minimizes irregularities at pattern edges during development.
Solution Approach 2:
The patent controls critical parameters such as resin compositional ratios (polyhydroxystyrene: 20-80 mass%), molecular weight (1,000-100,000), and functional group distribution. These parameter optimizations ensure uniform etching rates and smooth line edges while preserving high sensitivity to electron beam exposure.
3Reliability
If conventional mixed system resins are used to improve sensitivity, then sensitivity is improved, but pattern form and line edge roughness deteriorate due to heterogeneous mixing
Solution Approach 1:
The patent achieves homogeneous mixing at the molecular level by using copolymers where resin components are chemically bonded together in a single polymer chain. This eliminates the phase separation and heterogeneity issues found in conventional mixed systems, ensuring uniform pattern formation and smooth line edges while maintaining high sensitivity.
Solution Approach 2:
The patent creates a chemically integrated composite material where multiple resin functionalities are combined within a single copolymer structure. This molecular-level composite approach provides the benefits of multiple components (sensitivity enhancement) without the drawbacks of heterogeneous mixing (pattern distortion and rough edges).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high sensitivity, high resolution, good pattern form, and reduced line edge roughness, while minimizing outgassing, effectively addressing the limitations of existing technologies in electron beam, X-ray, and EUV lithography.
Implementation Method 1
a repeating unit (A) containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation
Implementation Method 2
a repeating unit (B) containing a group capable of decomposing and forming a carboxylic acid by the action of an acid
Data Source
AI summary
Provided is an actinic ray-sensitive or radiation-sensitive resin composition, a resist film formed with the composition, and a pattern-forming method using the same. The actinic ray-sensitive or radiation-sensitive resin composition includes (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less,(A) a repeating unit containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation,(B) a repeating unit containing a group capable of decomposing and forming a carboxylic acid by the action of an acid, and(C) a repeating unit containing a carbon-carbon unsaturated bond.