Resin Composition for EUV Lithography Pattern Quality
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Solution Overview
Problem
Current lithography techniques face challenges in achieving high sensitivity, high resolution, good pattern form, and reduced line edge roughness simultaneously, especially in super fine regions for electron beam, X-ray, and EUV ray lithography, due to issues with heterogeneous mixing of materials and insufficient sensitivity to these radiation sources.
Innovation Solution
An actinic ray-sensitive or radiation-sensitive resin composition is developed, comprising specific repeating units that include a group capable of decomposing and forming an acid upon irradiation, a carboxylic acid-forming group, and a carbon-carbon unsaturated bond, along with a solvent having a boiling temperature of 150°C or less, to enhance sensitivity, resolution, and line edge roughness while minimizing outgassing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mixed system of resin having photo-acid generator and dissolution-inhibiting compound is used, then sensitivity is improved, but pattern form and line edge roughness deteriorate due to heterogeneous mixing
Solution Approach 1:
The patent combines the photo-acid generator and dissolution-inhibiting compound into a single copolymer molecule rather than mixing them as separate materials. The copolymer contains both functional units: one that generates acid upon irradiation and another that inhibits dissolution, creating a homogeneous single-phase system that eliminates the heterogeneity problem while maintaining both sensitivity and pattern quality
Solution Approach 2:
The invention creates a composite functional structure at the molecular level by synthesizing a copolymer that integrates multiple functions (acid generation and dissolution inhibition) within a single polymer chain. This molecular-level composite approach allows both functionalities to work synergistically without the phase separation issues of physical mixtures
2Reliability
If pursuit of higher sensitization is made in positive resist for electron beams, then sensitivity is improved, but resolution and line edge roughness deteriorate
Solution Approach 1:
The patent changes the chemical parameters of the resist system by introducing a copolymer with specific functional units that alter the acid-base balance and dissolution characteristics. This parameter change allows the system to achieve high sensitivity through efficient acid generation while simultaneously improving resolution and line edge roughness through controlled dissolution inhibition at the molecular level
3Reliability
If resin with photo-acid generator in main chain or side chain is used, then sensitivity is improved, but heterogeneous mixing occurs with dissolution-inhibiting compound
Solution Approach 1:
The patent merges the photo-acid generator and dissolution-inhibiting compound into a single copolymer molecule, eliminating the separate phases that cause heterogeneous mixing. The resulting homogeneous copolymer solution ensures uniform distribution of both functionalities throughout the resist film, resolving the mixing issue while preserving sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high sensitivity, high resolution, good pattern form, and reduced line edge roughness, effectively addressing the limitations of existing techniques in electron beam, X-ray, and EUV ray lithography while minimizing outgassing and improving film quality.
Implementation Method 1
a repeating unit (A) containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation
Implementation Method 2
a repeating unit (B) containing a group capable of decomposing and forming a carboxylic acid by the action of an acid
Data Source
AI summary
Provided is an actinic ray-sensitive or radiation-sensitive resin composition, a resist film formed with the composition, and a pattern-forming method using the same. The actinic ray-sensitive or radiation-sensitive resin composition includes (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less,(A) a repeating unit containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation,(B) a repeating unit containing a group capable of decomposing and forming a carboxylic acid by the action of an acid, and(C) a repeating unit containing a carbon-carbon unsaturated bond.


