Resin Composition for Printed Wiring Boards with Optimized Filler Distribution
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Solution Overview
Problem
Highly filled thermosetting resin compositions for printed wiring boards improve thermal conductivity but compromise moldability, leading to issues like cracks, voids, and decreased solder heat resistance and metal foil peel strength.
Innovation Solution
A resin composition combining a cyanate ester compound, an epoxy resin, a first inorganic filler, and a second inorganic filler with a specific particle diameter ratio, dispersed using an ultrasonic homogenizer, to enhance thermal conductivity while maintaining moldability and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the resin composition is highly filled with inorganic filler to improve thermal conductivity, then thermal conductivity increases, but moldability deteriorates and cracks and voids occur
Solution Approach 1:
The patent applies parameter changes by optimizing the particle diameter distribution of inorganic fillers. Specifically, it uses a mixed filler system where 60-80 wt% of the filler has a particle diameter of 0.1-10 μm and 20-40 wt% has a particle diameter of 10-100 nm. This controlled parameter distribution allows achieving high thermal conductivity (3-10 W/mK) while maintaining adequate moldability and suppressing crack formation.
Solution Approach 2:
The patent employs composite materials by combining inorganic fillers with different particle diameter ranges in a thermosetting resin matrix. The composite filler system (mixing coarse 0.1-10 μm particles with fine 10-100 nm particles) creates a synergistic effect where the fine particles fill gaps between coarse particles, improving thermal conductivity while the controlled distribution prevents excessive resin volume reduction, thus maintaining moldability.
2Temperature
If the resin composition is highly filled with inorganic filler, then thermal conductivity improves, but adhesiveness between resin and filler decreases, resulting in decreased metal foil peel strength
Solution Approach 1:
The patent applies parameter changes by controlling the particle diameter distribution of inorganic fillers within specific ranges (0.1-10 μm for 60-80 wt% and 10-100 nm for 20-40 wt%). This optimized distribution maintains adequate resin volume (15-40 wt%) and improves resin-filler interfacial adhesion, thereby preserving metal foil peel strength while achieving high thermal conductivity.
Solution Approach 2:
The patent uses composite materials by creating a multi-scale filler system combining coarse (0.1-10 μm) and fine (10-100 nm) inorganic particles. The fine particles fill interstices between coarse particles, creating a dense composite structure that enhances thermal conductivity while the controlled composite architecture maintains sufficient resin content for strong interfacial bonding, thus preserving metal foil peel strength.
3Temperature
If the resin composition is highly filled with inorganic filler, then thermal conductivity improves, but solder heat resistance properties after moisture absorption deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle diameter distribution of inorganic fillers (0.1-10 μm for 60-80 wt%, 10-100 nm for 20-40 wt%) and the resulting resin volume content (15-40 wt%). This optimized parameter set achieves high thermal conductivity while maintaining adequate resin continuity and interfacial adhesion, thereby preserving solder heat resistance properties even after moisture absorption.
Solution Approach 2:
The patent employs composite materials by creating a hierarchical filler structure with coarse (0.1-10 μm) and fine (10-100 nm) particles. This composite architecture achieves high thermal conductivity through dense filler packing while maintaining sufficient resin volume (15-40 wt%) for continuous phases and strong interfaces, thus preserving reliability and solder heat resistance after moisture exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high thermal conductivity with improved moldability, metal foil peel strength, solder heat resistance, and elastic modulus, reducing the occurrence of cracks and voids in printed wiring boards.
Implementation Method 1
subjecting the dispersion to dispersion treatment by an ultrasonic homogenizer for 3 minutes
Data Source
AI summary
The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.