Resin Composition for Heat-Resistant Film with UV Absorption
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Solution Overview
Problem
Current resin compositions used in forming heat-resistant films for organic electroluminescent displays and other applications have insufficient light transmittance reduction in the short wavelength range, particularly in the 350 to 460 nm range, leading to potential malfunctions and leakage currents due to light penetration.
Innovation Solution
A resin composition comprising a polyimide, polybenzoxazole, phenolic resin, or polyhydroxystyrene resin, combined with a thermally color-developing compound and a photo-acid generator, which undergoes a heat treatment to achieve a significant reduction in transmittance to light in the 350 to 460 nm range, forming a heat-resistant film with improved sensitivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a coloring agent such as carbon black, organic or inorganic pigment or dye is added to reduce light transmittance in the visible light wavelength range, then light transmittance reduction is achieved, but the composition cannot be used as a positive-working photosensitive resin composition due to absorption of exposing light
Solution Approach 1:
The invention changes the absorption characteristics of the coloring agent by selecting specific compounds with absorption maxima at 500-750 nm that have minimal absorption at 350 nm and below. This parameter selection allows the composition to transmit exposing light (350 nm and below) while absorbing visible light (500-750 nm), enabling positive-working photosensitivity
Solution Approach 2:
The invention creates a composite resin composition combining a polyimide or polybenzoxazole with a specifically selected coloring agent and a photoacid generator. This composite structure achieves both light transmittance reduction in the visible range and positive-working photosensitivity by coordinating the optical properties of each component
2Illumination intensity
If a positive-working photosensitive resin composition is used with reduced light transmittance, then light absorption is improved, but the resin composition generally shows negative-working photosensitivity characteristics
Solution Approach 1:
The invention changes the photosensitivity mechanism by selecting a photoacid generator that operates at the exposing wavelength (350 nm and below) and a coloring agent that does not absorb at these wavelengths. This parameter coordination enables positive-working photosensitivity where the photoacid generator catalyzes the desired reaction only in exposed areas
Solution Approach 2:
The invention applies local quality by creating different chemical properties in different regions of the resin film: exposed regions undergo acid-catalyzed reactions that enable development, while unexposed regions remain unchanged. This spatial differentiation of chemical reactivity enables positive-working photosensitivity
3Reliability
If conventional resin compositions are used to form heat-resistant films, then film formation is achieved, but light transmittance reduction in the short wavelength range (350 to 460 nm) is insufficient
Solution Approach 1:
The invention changes the optical parameters of the heat-resistant film by incorporating a coloring agent with specific absorption characteristics (absorption maximum at 500-750 nm, minimal absorption at 350 nm and below). This parameter optimization achieves strong absorption in the visible range while maintaining transmittance in the UV range for exposing light
Solution Approach 2:
The invention converts the potential harm of light penetration causing malfunctions and leakage currents into a benefit by carefully selecting a coloring agent that absorbs harmful visible light (500-750 nm) while allowing exposing UV light (350 nm and below) to pass through for photosensitization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively reduces light transmittance in the 350 to 460 nm range, enhancing the reliability of organic electroluminescent displays by preventing malfunctions and leakage currents caused by light penetration, while maintaining high sensitivity to ultraviolet and visible light before heat treatment.
Implementation Method 1
a photo-acid generator
Implementation Method 2
a thermally color-developing compound capable of developing a color upon heating
Implementation Method 3
after a heat treatment at a temperature within the range from 200 to 350° C.
Data Source
AI summary
A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.