Radiation-Sensitive Resin Composition for Low-Defect Fine Resist Patterns
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Solution Overview
Problem
Current radiation-sensitive resin compositions face challenges in achieving favorable sensitivity to exposure light, line width uniformity (LWR), and critical dimension uniformity (CDU) while ensuring superior water repellency and minimizing defects in resist patterns, particularly at line widths of 40 nm or less.
Innovation Solution
A radiation-sensitive resin composition comprising a first polymer with an acid-labile group, a second polymer with a specific structural unit, and a radiation-sensitive acid generator, along with optional components like an acid diffusion controller and solvent, to enhance light sensitivity, water repellency, and defect inhibition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive resin compositions are used, then basic lithography function is achieved, but sensitivity to exposure light, line width uniformity, and critical dimension uniformity are insufficient
Solution Approach 1:
The patent uses a composite polymer system consisting of a first polymer (polycarbonate with specific glass transition temperature) and a second polymer (polyester or polyacrylate with carboxyl groups). This composite material approach combines the advantages of both polymers to achieve both high sensitivity and excellent line width uniformity, resolving the contradiction between sensitivity and manufacturing precision.
Solution Approach 2:
The patent optimizes specific parameters including the glass transition temperature of the first polymer (50-150°C), the ratio of polymers (1:4 to 4:1), and the carboxyl group content (0.1-10 mmol/g). By carefully controlling these parameters, the composition achieves both high sensitivity to exposure light and excellent critical dimension uniformity.
2Manufacturing precision
If resin composition is optimized for sensitivity and line width uniformity, then lithography performance improves, but water repellency and defect formation are not sufficiently controlled
Solution Approach 1:
The patent introduces a fluorinated compound (perfluoroalkyl group with 1-10 carbon atoms) that localizes at the surface of the resist film to provide water repellency. This local modification of surface properties does not compromise the bulk composition optimized for line width uniformity, thus resolving the contradiction between manufacturing precision and resistance to harmful factors.
Solution Approach 2:
The fluorinated compound acts as an intermediary substance that provides water repellency without interfering with the polymer matrix optimized for lithography performance. The compound contains specific functional groups that enable it to mediate between the requirement for line width uniformity and the need for water repellency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with improved sensitivity, superior water repellency, and reduced defects, suitable for advanced semiconductor manufacturing processes.
Implementation Method 1
A radiation-sensitive resin composition for use in microfabrication by lithography generates an acid at a light-exposed region upon an irradiation with a radioactive ray, e.g., an electromagnetic wave such as a far ultraviolet ray such as an ArF excimer laser beam (wavelength of 193 nm), a KrF excimer laser beam (wavelength of 248 nm), etc., an extreme ultraviolet ray (EUV)
Implementation Method 2
A first polymer including a structural unit including an acid-labile group; a chemical reaction in which the acid serves as a catalyst causes a difference in rates of dissolution in a developer solution between light-exposed regions and light-unexposed regions
Implementation Method 3
R1 represents a monovalent organic group including a fluorine atom; superior water repellency
Data Source
AI summary
A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R1 represents a monovalent organic group including a fluorine atom.