Resin Composition for PCB Laminate with Flame Retardancy
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Solution Overview
Problem
Conventional printed circuit board resins, such as epoxy resins, offer high thermal and chemical resistance but are fragile and lack impact resistance, while N,O-heterocyclic compounds improve mechanical properties but result in insufficient flammability, requiring energy-consuming high-temperature curing methods that lack reaction uniformity control.
Innovation Solution
A resin composition comprising a stable solution obtained by ring-opening polymerization of an N,O-heterocyclic compound and a DOPO-based compound, used as a hardener, which provides a laminate with enhanced thermal, mechanical, and flammability properties, along with improved moisture resistance and dimensional stability, without the need for expensive energy-intensive curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxy resin is used to provide high thermal and chemical resistance, then thermal resistance and chemical stability are improved, but impact resistance and toughness deteriorate
Solution Approach 1:
The patent uses a composite curing system combining N,O-heterocyclic compound and phosphorus-containing compound to cure epoxy resin, creating a cross-linked network that integrates the thermal stability of epoxy with the toughness and impact resistance contributed by the heterocyclic structure and phosphorus additive
2Strength
If N,O-heterocyclic compound is used as hardener to improve mechanical properties, then toughness and impact resistance are improved, but flammability deteriorates
Solution Approach 1:
The patent merges N,O-heterocyclic compound with phosphorus-containing compound in a dual-curing system, where the phosphorus component provides flame retardancy while the heterocyclic component contributes mechanical strength and toughness, achieving synergistic improvement of both properties
Solution Approach 2:
The composite curing system combines two different chemical compounds with complementary functions: N,O-heterocyclic for mechanical enhancement and phosphorus-containing for flame retardancy, creating a multi-functional hardener system
3Object-affected harmful factors
If high-temperature curing is applied to enhance flammability, then flammability is improved, but energy consumption increases and reaction uniformity deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the curing system by introducing phosphorus-containing compound with specific chemical structure and reactivity, enabling flame retardancy to be achieved through chemical composition rather than thermal processing parameters, thus avoiding high energy consumption
Solution Approach 2:
The phosphorus-containing compound acts as an intermediary that provides flame retardancy through its chemical structure and decomposition behavior, mediating the flame resistance property without requiring high-temperature curing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a laminate with high glass transition temperature, excellent moisture resistance, and improved flammability, while maintaining low water absorption and dimensional stability, thus addressing the limitations of conventional resins and N,O-heterocyclic compounds.
Implementation Method 1
a polymerization product of a N,O-heterocyclic compound
Implementation Method 2
the cross-linking reaction of the polymer itself
Data Source
AI summary
A resin composition is provided. The resin composition comprises:an epoxy resin; anda hardener, which is a stable solution obtainable from the following steps:(a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution:wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification;(b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and(c) cooling the polymer solution to obtain the stable solution,wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.