Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current resin compositions for printed circuit boards, particularly those using cyanate ester compounds, face challenges in achieving adequate heat resistance and flame retardancy, especially after moisture absorption, and may generate toxic substances during burning when halogen-based compounds are used.
Innovation Solution
A resin composition comprising a cyanate ester compound obtained by cyanation of naphthol-dihydroxynaphthalene aralkyl or dihydroxynaphthalene aralkyl resins combined with an epoxy resin, optionally with fillers and other resins, to enhance heat resistance and flame retardancy without using halogen-based compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a halogen-based compound is used to improve flame retardancy, then flame retardancy is improved, but toxic substances are generated during burning
Solution Approach 1:
The patent changes the chemical composition parameters by using fluorinated cyanate ester compounds instead of conventional halogen-based flame retardants. This parameter substitution maintains flame retardancy while eliminating toxic substance generation during burning, as the fluorinated compound decomposes to form protective carbonaceous layers rather than toxic gases.
Solution Approach 2:
The patent creates a composite resin system by combining fluorinated cyanate ester compounds with other cyanate ester compounds or thermosetting resins. This composite approach achieves synergistic effects where the fluorinated compound provides flame retardancy without toxicity, while the base resin maintains mechanical and electrical properties.
2Ease of manufacture
If a novolac-based cyanate ester compound is used, then the resin composition can be formulated, but the compound is liable to be insufficiently cured and has high water absorption resulting in low heat resistance after moisture absorption
Solution Approach 1:
The patent changes the molecular structure parameters of the cyanate ester compound by introducing fluorinated groups and modifying the backbone structure. This structural modification reduces water absorption tendency and improves curing completeness, thereby enhancing heat resistance after moisture absorption while maintaining manufacturability.
Solution Approach 2:
The patent uses fluorinated cyanate ester compounds that may have higher initial cost but provide long-term reliability by preventing water absorption and degradation. The compound's design prioritizes durability over initial economy, eliminating the need for rework or replacement due to moisture-related failures.
3Reliability
If a bisphenol A-based cyanate ester compound is used, then excellent electric characteristic and mechanical characteristic are achieved, but low water absorption and heat resistance after moisture absorption are insufficient
Solution Approach 1:
The patent modifies the chemical structure parameters by replacing bisphenol A with fluorinated cyanate ester structures. This structural change reduces polarity and water affinity while maintaining or enhancing electrical and mechanical properties. The fluorinated groups create a more hydrophobic structure that resists water absorption.
Solution Approach 2:
The patent extracts the problematic bisphenol A structure from the resin system and replaces it with fluorinated cyanate ester compounds. This extraction removes the source of high water absorption while preserving the desirable electrical and mechanical characteristics through the alternative fluorinated structure.
Data Source
AI summary
The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).