Resin composition for printed wiring board, prepreg, resin composite sheet, and metal foil-clad laminate plate
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Solution Overview
Problem
Current resin compositions for printed circuit boards, particularly those using cyanate ester compounds, face challenges in achieving adequate heat resistance and flame retardancy, especially after moisture absorption, and often rely on halogen-based compounds that can generate toxic substances during burning.
Innovation Solution
A resin composition comprising a cyanate ester compound obtained through the cyanation of naphthol-dihydroxynaphthalene aralkyl resins, combined with an epoxy resin and a filler, which improves heat resistance and flame retardancy without using halogen-based compounds, thereby enhancing performance after moisture absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a halogen-based compound is used to improve flame retardancy, then flame retardancy is improved, but toxic substances are generated during burning
Solution Approach 1:
The invention changes the chemical composition parameters by using fluorinated cyanate ester compounds with specific molecular structures (formulas 1-8) instead of conventional halogen-based flame retardants. This parameter change achieves flame retardancy through the inherent properties of the cyanate ester compound structure rather than through halogen-based mechanisms that produce toxic fumes.
Solution Approach 2:
The invention creates a composite resin system combining fluorinated cyanate ester compounds with epoxy resins and inorganic fillers. This composite material approach achieves flame retardancy through the synergistic effect of the cyanate ester compound's molecular structure and the inorganic filler content (50-80 wt%), eliminating the need for separate halogen-based flame retardant additives.
2Ease of manufacture
If a novolac-based cyanate ester compound is used, then the resin composition can be formulated, but the compound is liable to be insufficiently cured and has high water absorption resulting in low heat resistance after moisture absorption
Solution Approach 1:
The invention changes the chemical structure parameters by using fluorinated cyanate ester compounds with specific repeating unit structures (formulas 1-8) that contain fluorinated aromatic rings. This structural modification fundamentally changes the curing behavior and moisture resistance properties, achieving complete curing and low water absorption that novolac-based compounds cannot achieve.
Solution Approach 2:
The invention extracts the problematic structural features from novolac-based cyanate ester compounds (the polyhydroxy naphthalene backbone) and replaces them with fluorinated aromatic structures. This extraction of the problematic structural element eliminates the insufficient curing and high water absorption issues while retaining the cyanate ester functionality.
3Temperature
If various cyanate ester compounds with different structures are examined to improve heat resistance and flame retardancy, then heat resistance may be improved, but low water absorption and heat resistance after moisture absorption remain insufficient
Solution Approach 1:
The invention systematically changes the chemical parameters by introducing fluorinated aromatic structures with specific repeating units (formulas 1-8) where k, I, m, and n are controlled parameters. This parameter optimization achieves simultaneous improvement in heat resistance (glass transition temperature above 280°C) and moisture resistance (water absorption below 0.1%) that previous structural variations未能 achieve.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent heat resistance and flame retardancy while avoiding the toxicity issues associated with halogen-based compounds, ensuring superior performance in printed circuit boards, prepregs, and metal foil clad laminates.
Implementation Method 1
a cyanate ester compound (A) having at least one structure selected from the group consisting of structures represented by the following formula (1), the following formula (2) and the following formula (8)
Data Source
AI summary
The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).