Resin Composition for High-Frequency Wiring Boards
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Solution Overview
Problem
Existing resin compositions for high-frequency wiring boards face challenges in maintaining low dielectric properties and high glass transition temperatures while minimizing water absorption and the subsequent increase in dielectric constant and loss tangent.
Innovation Solution
A resin composition comprising a maleimide compound represented by Formula (1), a modified polyphenylene ether with a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound, which enhances compatibility and suppresses water absorption, maintaining low dielectric properties even after water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyphenylene ether is modified to enhance heat resistance, then glass transition temperature is improved, but water absorption increases and dielectric properties deteriorate
Solution Approach 1:
The patent uses a composite resin system combining modified polyphenylene ether (with unsaturated double bonds), maleimide compound, and allyl compound crosslinking agent. This composite approach achieves high heat resistance through crosslinking while the specific composition ratio and chemical structure control water absorption, resolving the contradiction between heat resistance improvement and water absorption prevention.
Solution Approach 2:
The patent optimizes specific parameters including the chemical structure of maleimide compound (Formula 1 with specific substituents), the ratio of components, and the degree of modification of polyphenylene ether. By changing these parameters, the resin achieves both high glass transition temperature and low water absorption, maintaining excellent dielectric properties.
2Temperature
If crosslinking is enhanced to improve heat resistance, then glass transition temperature increases, but dielectric constant and loss tangent increase due to water absorption
Solution Approach 1:
The patent employs a composite crosslinking system using maleimide compound and allyl compound together with modified polyphenylene ether. This composite crosslinking network provides high heat resistance while the specific chemical structures and ratios control water absorption, preventing deterioration of dielectric properties even after water absorption occurs.
Solution Approach 2:
The patent optimizes the crosslinking density and network structure by controlling the component ratios and chemical structures. The maleimide compound with specific substituents (Formula 1) and the allyl compound create a crosslinked network that maintains low dielectric constant and loss tangent even after water absorption, while achieving high glass transition temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a high glass transition temperature, low water absorption rate, and effectively suppresses increases in dielectric constant and loss tangent after water absorption, ensuring reliable performance in high-frequency applications.
Implementation Method 1
a resin composition comprising a maleimide compound represented by Formula (1), a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound
Data Source
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AI summary
A resin composition is used which contains a maleimide compound represented by the following Formula (1), a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking agent containing an allyl compound. In Formula (1), s represents 1 to 5 and RA, RB, RC, and RD each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group.