Resin Composition for High-Frequency Wiring Boards
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Solution Overview
Problem
Conventional resin compositions for high-frequency wiring boards, such as millimeter-wave radar boards, face challenges in achieving low dielectric properties and high heat resistance, with existing substrates often exhibiting high dielectric constants and loss tangents due to the use of certain initiators that generate polar groups during curing.
Innovation Solution
A resin composition comprising a compound with a specific arylene group, a crosslinking type curing agent, and an azo compound without heteroatoms other than nitrogen, which acts as an initiator to minimize the generation of polar groups, thereby reducing dielectric properties and enhancing heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional initiators are used during curing, then the curing process proceeds effectively, but polar groups are generated which increase dielectric constant and dielectric loss tangent
Solution Approach 1:
The patent changes the chemical structure parameter of the initiator from conventional types to a specific azo compound with formula (2) where R4 and R5 are hydrogen or alkyl groups. This parameter change eliminates heteroatoms that would generate polar groups, thereby improving dielectric properties while maintaining curing effectiveness through the azo group's decomposition characteristics.
Solution Approach 2:
The patent applies local quality by specifically designing the initiator molecule structure where only hydrogen or alkyl groups are present as substituents on the azo group. This localized structural control ensures that no polar groups are generated at the initiation site, addressing the dielectric property issue at its source while preserving the necessary initiating function.
2Temperature
If vinyl groups are introduced to improve heat resistance, then heat resistance increases, but dielectric properties deteriorate
Solution Approach 1:
The patent extracts the harmful effect of polar group generation by removing heteroatoms from the initiator structure. By using an azo compound with only hydrogen or alkyl substituents, the invention eliminates the source of polar groups that would otherwise increase dielectric loss, while the crosslinking polymerization of vinyl groups maintains heat resistance.
Solution Approach 2:
The patent creates a composite effect by combining the polyphenylene ether base resin with a specifically designed azo initiator and crosslinking curing agent. This composite system achieves both heat resistance through crosslinking and low dielectric properties through the absence of polar group-generating structures.
3Strength
If crosslinking polymerization is performed to improve heat resistance, then heat resistance and mechanical strength improve, but the dielectric loss tangent increases due to polar group formation
Solution Approach 1:
The patent changes the chemical composition parameters of the initiator system to eliminate heteroatoms that generate polar groups. The use of azo compounds with hydrogen or alkyl substituents maintains the crosslinking functionality while changing the byproduct structure to be non-polar, thereby resolving the contradiction between strength improvement and dielectric property deterioration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed resin composition achieves a cured product with low dielectric properties and high heat resistance, suitable for high-frequency applications, by suppressing the formation of polar groups during the curing process.
Implementation Method 1
a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group
Data Source
AI summary
A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group.In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.