Resin Composition for High Tg Copper-Clad Laminates
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Solution Overview
Problem
Current copper-clad laminates and resin compositions fail to meet the demands for high-density multilayer boards with improved glass transition temperature, heat resistance, and stable electrical properties, particularly in terms of lower dissipation factor aging rate, temperature coefficient of dielectric constant, and temperature coefficient of dissipation factor.
Innovation Solution
A resin composition comprising 100 parts of polyolefin, 20-150 parts of a copolymer with a specific monomer structure, and 10-40 parts of an unsaturated bond-containing crosslinking agent, which forms a prepreg, resin film, or printed circuit board with enhanced properties such as a glass transition temperature greater than 160°C, resistance variation rate less than 10% under interconnect stress, and specific coefficients for dielectric constant and dissipation factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional resin compositions are used for copper-clad laminates, then general characteristics are maintained, but glass transition temperature is insufficient and electrical properties deteriorate with aging
Solution Approach 1:
The patent uses a composite resin system combining polyolefin base resin with copolymer modifiers containing specific structural units (Formula 1 and Formula 2), creating a multi-component material system that achieves both high Tg and stable electrical properties through synergistic effects of different polymer components
Solution Approach 2:
The patent systematically adjusts compositional parameters including the ratio of copolymer to polyolefin (20-150 parts), the specific content of structural units in the copolymer (55-90 wt%), and crosslinking agent quantity (10-40 parts) to optimize both thermal and electrical performance characteristics
2Productivity
If higher density multilayer board structures are implemented, then integration is improved, but heat dissipation and stress resistance become more difficult
Solution Approach 1:
The patent modifies the resin composition parameters to achieve high Tg (>160°C) which directly improves heat resistance, allowing denser multilayer structures to be manufactured without compromising thermal performance or reliability under stress conditions
3Reliability
If dissipation factor aging rate is reduced, then signal integrity is improved, but this requires specific resin composition not currently available
Solution Approach 1:
The patent develops a specific composite resin formulation where polyolefin is combined with copolymer containing Formula 1 and Formula 2 structural units in controlled ratios, creating a material that inherently provides low dissipation factor aging rate while maintaining manufacturability through established processing methods
Solution Approach 2:
The patent optimizes the compositional parameters including crosslinking agent content (10-40 parts per 100 parts polyolefin) and copolymer structure ratios to achieve the target dissipation factor aging rate while keeping the manufacturing process compatible with existing production capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves improved multi-layer board heat resistance, interconnect stress reliability, and stable electrical properties, including a glass transition temperature of at least 160°C, a dissipation factor aging rate of less than or equal to 157%, and temperature coefficients within specified limits, thereby enhancing the performance and reliability of copper-clad laminates and printed circuit boards.
Implementation Method 1
a copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2)... an unsaturated bond-containing crosslinking agent
Implementation Method 2
a glass transition temperature greater than 160°C... high glass transition temperature (Tg), better and more stable electrical properties
Data Source
AI summary
A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a polyolefin, which is different from the copolymer in (B) below; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.